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Low-power and low-energy VLSI has become an important issue in today's consumer electronics.This book is a collection of pioneering applied research papers in low power VLSI design and technology.A comprehensive introductory chapter presents the current status of the industry and academic research in the area of low power VLSI design and technology.Other topics cover logic synthesis, floorplanning, circuit design and analysis, from the perspective of low power requirements.The readers will have a sampling of some key problems in this area as the low power solutions span the entire spectrum of the design process. The book also provides excellent references on up-to-date research and development issues with practical solution techniques.
Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.
Research collected from many disciplines, including computer architecture, computer-aided design, parallel algorithms, semiconductor technology, and testing.
The current cutting-edge VLSI circuit design technologies provide end-users with many applications, increased processing power and improved cost effectiveness. This trend is accelerating, with significant implications on future VLSI and systems design. VLSI design engineers are always in demand for front-end and back-end design applications.The book aims to give future and current VSLI design engineers a robust understanding of the underlying principles of the subject. It not only focuses on circuit design processes obeying VLSI rules but also on technological aspects of fabrication. The Hardware Description Language (HDL) Verilog is explained along with its modelling style. The book also covers CMOS design from the digital systems level to the circuit level. The book clearly explains fundamental principles and is a guide to good design practices.The book is intended as a reference book for senior undergraduate, first-year post graduate students, researchers as well as academicians in VLSI design, electronics & electrical engineering and materials science. The basics and applications of VLSI design from digital system design to IC fabrication and FPGA Prototyping are each covered in a comprehensive manner. At the end of each unit is a section with technical questions including solutions which will serve as an excellent teaching aid to all readers.Technical topics discussed in the book include: • Digital System Design• Design flow for IC fabrication and FPGA based prototyping • Verilog HDL• IC Fabrication Technology• CMOS VLSI Design• Miscellaneous (It covers basics of Electronics, and Reconfigurable computing, PLDs, Latest technology etc.).
The trend in design and manufacturing of very large-scale integrated (VLSI) circuits is towards smaller devices on increasing wafer dimensions. VLSI is the inter-disciplinary science of the process of creating an integrated circuit (IC) by combining thousands of transistors into a single chip. VLSI design can reduce the area of the circuit, making it less expensive and requiring less power.The book gives an understanding of the underlying principles of the subject. It not only focuses on circuit design process obeying VLSI rules but also on technological aspects of prototyping and fabrication. All the clocking processes, interconnects, and circuits of CMOS are explained in this book in an understandable format. The book provides contents on VLSI Physical Design Automation, Design of VLSI Devices and also its Impact on Physical Design.The book is intended as a reference book for senior undergraduate, first-year post graduate students, researchers as well as academicians in VLSI design, electronics & electrical engineering, and materials science. The basics and applications of VLSI design from STA, PDA and VLSI Testing along with FPGA based Prototyping are covered in a comprehensive manner.The latest technology used in VLSI design is discussed along with the available tools for FPGA prototyping as well as ASIC design. Each unit contains technical questions with solutions at the end.Technical topics discussed in the book include: • Static Timing Analysis• CMOS Layout and Design rules• Physical Design Automation• Testing of VLSI Circuits• Software tools for Frontend and Backend design.
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Responding to recent developments and a growing VLSI circuit manufacturing market, Technology Computer Aided Design: Simulation for VLSI MOSFET examines advanced MOSFET processes and devices through TCAD numerical simulations. The book provides a balanced summary of TCAD and MOSFET basic concepts, equations, physics, and new technologies related to TCAD and MOSFET. A firm grasp of these concepts allows for the design of better models, thus streamlining the design process, saving time and money. This book places emphasis on the importance of modeling and simulations of VLSI MOS transistors and TCAD software. Providing background concepts involved in the TCAD simulation of MOSFET devices, it presents concepts in a simplified manner, frequently using comparisons to everyday-life experiences. The book then explains concepts in depth, with required mathematics and program code. This book also details the classical semiconductor physics for understanding the principle of operations for VLSI MOS transistors, illustrates recent developments in the area of MOSFET and other electronic devices, and analyzes the evolution of the role of modeling and simulation of MOSFET. It also provides exposure to the two most commercially popular TCAD simulation tools Silvaco and Sentaurus. • Emphasizes the need for TCAD simulation to be included within VLSI design flow for nano-scale integrated circuits • Introduces the advantages of TCAD simulations for device and process technology characterization • Presents the fundamental physics and mathematics incorporated in the TCAD tools • Includes popular commercial TCAD simulation tools (Silvaco and Sentaurus) • Provides characterization of performances of VLSI MOSFETs through TCAD tools • Offers familiarization to compact modeling for VLSI circuit simulation R&D cost and time for electronic product development is drastically reduced by taking advantage of TCAD tools, making it indispensable for modern VLSI device technologies. They provide a means to characterize the MOS transistors and improve the VLSI circuit simulation procedure. The comprehensive information and systematic approach to design, characterization, fabrication, and computation of VLSI MOS transistor through TCAD tools presented in this book provides a thorough foundation for the development of models that simplify the design verification process and make it cost effective.
Improve your circuit-design potential with this expert guide to the devices and technology used in mixed analog-digital VLSI chips for such high-volume applications as hard-disk drives, wireless telephones, and consumer electronics. The book provides you with a critical understanding of device models, fabrication technology, and layout as they apply to mixed analog-digital circuits.You will learn about the many device-modeling requirements for analog work, as well as the pitfalls in models used today for computer simulators such as Spice. Also included is information on fabrication technologies developed specifically for mixed-signal VLSI chips, plus guidance on the layout of mixed analog-digital chips for a high degree of analog-device matching and minimum digital-to-analog interference.This reference book features an intuitive introduction to MOSFET operation that will enable you to view with insight any MOSFET model ? besides thorough discussions on valuable large-signal and small-signal models.Filled with practical information, this first-of-its-kind book will help you grasp the nuances of mixed-signal VLSI-device models and layout that are crucial to the design of high-performance chips.
Contents:A New Way to Acquire Knowledge (H-Y Wang)An SPN Knowledge Representation Scheme (J Gattiker & N Bourbakis)On the Deep Structures of Word Problems and Their Construction (F Gomez)Resolving Conflicts in Inheritance Reasoning with Statistical Approach (C W Lee)Integrating High and Low Level Computer Vision for Scene Understanding (R Malik & S So)The Evolution of Commercial AI Tools: The First Decade (F Hayes-Roth)Reengineering: The AI Generation — Billions on the Table (J S Minor Jr)An Intelligent Tool for Discovering Data Dependencies in Relational DBS (P Gavaskar & F Golshani)A Case-Based Reasoning (CBR) Tool to Assist Traffic Flow (B Das & S Bayles)A Study of Financial Expert System Based on Flops (T Kaneko & K Takenaka)An Associative Data Parallel Compilation Model for Tight Integration of High Performance Knowledge Retrieval and Computation (A K Bansal)Software Automation: From Silly to Intelligent (J-F Xu et al.)Software Engineering Using Artificial Intelligence: The Knowledge Based Software Assistant (D White)Knowledge Based Derivation of Programs from Specifications (T Weight et al.)Automatic Functional Model Generation for Parallel Fault Design Error Simulations (S-E Chang & S A Szygenda)Visual Reverse Engineering Using SPNs for Automated Diagnosis and Functional Simulation of Digital Circuits (J Gattiker & S Mertoguno)The Impact of AI in VLSI Design Automation (M Mortazavi & N Bourbakis)The Automated Acquisition of Subcategorizations of Verbs, Nouns and Adjectives from Sample Sentences (F Gomez)General Method for Planning and Rendezvous Problems (K I Trovato)Learning to Improve Path Planning Performance (P C Chen)Incremental Adaptation as a Method to Improve Reactive Behavior (A J Hendriks & D M Lyons)An SPN-Neural Planning Methodology for Coordination of Multiple Robotic Arms with Constrained Placement (N Bourbakis & A Tascillo) Readership: Computer scientists, artificial intelligence practitioners and robotics users. keywords: