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In recent years remarkable progress has been made in the development of materials for ultrasonic transducers. There is a continuing trend towards increasingly higher frequency ranges for the application of ultrasonic trans ducers in modern technology. The progress in this area has been especially rapid and articles and papers on the subject are scattered over numerous technical and scientific journals in this country and abroad. Although good books have appeared on ultrasonics in general and ultrasonic transducers in particular in which, for obvious reasons, materials play an important part, no comprehensive treatise is available that represents the state-of-the-art on modern ultrasonic transducer materials. This book intends to fill a need for a thorough review of the subject. Not all materials are covered of which, theoretically, ultrasonic trans ducers could be made but those that are or may be of technical impor tance and which have inherent electro acoustic transducer properties, i.e., materials that are either magnetostrictive, electrostrictive, or piezoelectric. The book has been devided into three parts which somewhat reflect the historic development of ultrasonic transducer materials for important tech nical application. Chapter 1 deals with magnetostrictive materials, magnetostrictive met als and their alloys, and magnetostrictive ferrites (polycrystalline ceramics). The metals are useful especially in cases where ruggednes of the transducers are of overriding importance and in the lower ultrasonic frequency range.
Ultrasonic transducers are key components in sensors for distance, flow and level measurement as well as in power, biomedical and other applications of ultrasound. Ultrasonic transducers reviews recent research in the design and application of this important technology. Part one provides an overview of materials and design of ultrasonic transducers. Piezoelectricity and basic configurations are explored in depth, along with electromagnetic acoustic transducers, and the use of ceramics, thin film and single crystals in ultrasonic transducers. Part two goes on to investigate modelling and characterisation, with performance modelling, electrical evaluation, laser Doppler vibrometry and optical visualisation all considered in detail. Applications of ultrasonic transducers are the focus of part three, beginning with a review of surface acoustic wave devices and air-borne ultrasound transducers, and going on to consider ultrasonic transducers for use at high temperature and in flaw detection systems, power, biomedical and micro-scale ultrasonics, therapeutic ultrasound devices, piezoelectric and fibre optic hydrophones, and ultrasonic motors are also described. With its distinguished editor and expert team of international contributors,Ultrasonic transducers is an authoritative review of key developments for engineers and materials scientists involved in this area of technology as well as in its applications in sectors as diverse as electronics, wireless communication and medical diagnostics. Reviews recent research in the design and application of ultrasonic transducers Provides an overview of the materials and design of ultrasonic transducers, with an in-depth exploration of piezoelectricity and basic configurations Investigates modelling and characterisation, applications of ultrasonic transducers, and ultrasonic transducers for use at high temperature and in flaw detection systems
This volume contains the Proceedings of the International Workshop on the Design of Power Sonic and Ultrasonic Transducers, which was held in the Maison de l'Entreprise et des Technologies Nouvelles, Marcq en Baroeul, near Lille, France, on May 26 and 27, 1987. The main objective of this Workshop was to discuss all aspects of high power problems in the design of electroacoustic transducers and to stimulate an exchange of knowledge and experience between researchers and industrial ists involved in this multidisciplinary field. The scientific program included 13 invited contributions, and there were 80 participants from England, France, Italy, Spain, Sweden and the United States. The editors wish to thank the authors and attendees for their active par ticipation, and they hope that these Proceedings will allow readers to share in the stimulating atmosphere of the sessions. They also wish to thank eve ryone who undertook simultaneous translation, clerical work, typing of the Proceedings, production of the illustrations, or any other of the numerous tasks connected with this venture. Special mention has to be made of Mrs. E. Litton (ISEN, Lille) for her constant and kind help from the beginning of the project to the very end of the editing, Dr. R. Bossut (ISEN, Lille) for his efficient proofreading, and Dr. H.U. Daniel (Springer-Verlag) for his interest in these Proceedings as well as his kind and efficient support.
Capacitive micromachined ultrasonic transducers (CMUTs), have been widely studied in academia and industry over the last decade. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield. Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored. Two important interfaces of packaging that this thesis explores are device encapsulation (the interface between CMUTs and patients) and full electronic integration of large scale 2D arrays (the interface between CMUTs and electronics). In the first part of the work, I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy. While hermetic sealing can protect many other MEMS devices, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criterion very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than room temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Four designs, providing acoustic crosstalk suppression, flexible substrate, lens focusing, and blood flow monitoring using PDMS layer were also demonstrated. The second part of the work, presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity ([lowercase Sigma] = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer. Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system. With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.
This second edition provides comprehensive information on electromagnetic acoustic transducers (EMATs), from the theory and physical principles of EMATs to the construction of systems and their applications to scientific and industrial ultrasonic measurements on materials. The original version has been complemented with selected ideas on ultrasonic measurement that have emerged since the first edition was released. The book is divided into four parts: PART I offers a self-contained description of the basic elements of coupling mechanisms along with the practical designing of EMATs for various purposes. Several implementations to compensate for EMATs’ low transfer efficiency are provided, along with useful tips on how to make an EMAT. PART II describes the principle of electromagnetic acoustic resonance (EMAR), which makes the most of EMATs’ contactless nature and is the most successful amplification mechanism for precise measurements of velocity and attenuation. PART III applies EMAR to studying physical acoustics. New measurements have emerged with regard to four major subjects: in situ monitoring of dislocation behavior, determination of anisotropic elastic constants, pointwise elasticity mapping (RUM), and acoustic nonlinearity evolution. PART IV deals with a variety of individual issues encountered in industrial applications, for which the EMATs are believed to be the best solutions. This is proven by a number of field applications.
As a large variety of transducers are required for the current needs of NDT applications, this book gives a consolidated account regarding the basic principles, applications, advantages and limitations, design considerations, materials and methods used for their evaluation and calibration etc. by the technocrats and professionals involved in ultrasonic NDT.
This updated guide to the current state-of-the-art of this complex and multidisciplinary area fills an urgent need for a unified source of information on piezoelectric devices and their astounding variety of existing and emerging applications. New understandings underlying the principles of Piezoelectric Transducers, new technological advances in its applications, and new areas of utility for these transducers made a second edition of this book inevitable.
The book discusses the underlying physical principles of piezoelectric materials, important properties of ferroelectric/piezoelectric materials used in today’s transducer technology, and the principles used in transducer design. It provides examples of a wide range of applications of such materials along with the appertaining rationales. With contributions from distinguished researchers, this is a comprehensive reference on all the pertinent aspects of piezoelectric materials.
In this book Ian Sinclair provides the practical knowhow required by technician engineers, systems designers and students. The focus is firmly on understanding the technologies and their different applications, not a mathematical approach. The result is a highly readable text which provides a unique introduction to the selection and application of sensors, transducers and switches, and a grounding in the practicalities of designing with these devices.The devices covered encompass heat, light and motion, environmental sensing, sensing in industrial control, and signal-carrying and non-signal switches. Get up to speed in this key topic through this leading practical guide Understand the range of technologies and applications before specifying Gain a working knowledge with a minimum of maths