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This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
The book details sources of thermal energy, methods of capture, and applications. It describes the basics of thermal energy, including measuring thermal energy, laws of thermodynamics that govern its use and transformation, modes of thermal energy, conventional processes, devices and materials, and the methods by which it is transferred. It covers 8 sources of thermal energy: combustion, fusion (solar) fission (nuclear), geothermal, microwave, plasma, waste heat, and thermal energy storage. In each case, the methods of production and capture and its uses are described in detail. It also discusses novel processes and devices used to improve transfer and transformation processes.
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
This book provides a comprehensive overview on the latest developments in the control, operation, and protection of microgrids. It provides readers with a solid approach to analyzing and understanding the salient features of modern control and operation management techniques applied to these systems, and presents practical methods with examples and case studies from actual and modeled microgrids. The book also discusses emerging concepts, key drivers and new players in microgrids, and local energy markets while addressing various aspects from day-ahead scheduling to real-time testing of microgrids. The book will be a valuable resource for researchers who are focused on control concepts, AC, DC, and AC/DC microgrids, as well as those working in the related areas of energy engineering, operations research and its applications to energy systems. Presents modern operation, control and protection techniques with applications to real world and emulated microgrids; Discusses emerging concepts, key drivers and new players in microgrids and local energy markets; Addresses various aspects from day-ahead scheduling to real-time testing of microgrids.
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.