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An interdisciplinary group of materials scientists, physicists, chemists and engineers come together in this book to discuss recent advances in the structure and morphology of thin films. Both scientific and technological issues are addressed. Work on thin films for a host of applications including microelectronics, optics, tribology, biomedical technologies and microelectromechanical systems (MEMS) are featured. Topics include: kinetics of growth; grain growth; instabilities, segregation and ordering; silicides; metallization; stresses in thin films; deposition and growth simulations; energetic growth processes; diamond films and carbide and nitride films.
By illustrating a wide range of specific applications in all major industries, this work broadens the coverage of X-ray diffraction beyond basic tenets, research and academic principles. The book serves as a guide to solving problems faced everyday in the laboratory, and offers a review of the current theory and practice of X-ray diffraction, major
Proceedings of the March 1997 symposium, the central thrust being the relationship of magnetic properties and device performance to structure at the atomic, nanometer, and submicron length scales in these systems of reduced dimensionality. The 89 contributions cover the following topics: synthesis, processing, and characterization; novel applications and approaches for magnetism; nano-microstructure and magnetic properties; structure and properties--mixing, strain, and steps; nanoscale magnetic confinement, particles, and arrays; magnetization reversal and domain structure; synthesis and characterization; synchrotron radiation studies of magnetic materials; magneto-optical properties, effects, and measurements; magnetic phenomena; CMR and tunneling; and interlayer coupling and spin polarization. Annotation copyrighted by Book News, Inc., Portland, OR
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
The focus of semiconductor wafer processing is rapidly changing. Pure device performance is no longer sufficient to ensure a technology's success as IC chips approach 1GB. Yield, reliability, cost and manufacturability are principal drivers of the industry. Great strides have been made in understanding the science and impact of front-end (pre-metal) chemical surface preparations and are beginning to influence the 'real' technology and its evolution. Efforts in understanding particle and metals removal, along with Si surface etching and microroughness are prime examples of areas where work is beginning to pay off together with processes related to the back-end (post-metal). The focus of this book is to report new findings and to discuss surface preparation with an emphasis on gaining a mechanistic understanding of the underlying science upon which the technology is based. Topics include: megasonic cleaning; SC1 technology; surface preparation and gate oxide reliability; CMP/CMP cleaning; post-etch processing; surface microroughness; wet chemical cleaning and gate oxide integrity; analytical studies of surfaces; wet chemical cleaning/etching; dry wafer cleaning; and environmentally friendly processing.
This book brings together an interdisciplinary group of surface physicists, chemists and materials scientists to present the most current advances in the area of surface science. Both scientific and technological issues are addressed. Topics include: surface and step structure; morphology, roughness and instabilities; kinetic processes; nucleation on surfaces and interfaces; mechanics of surfaces; self-assembled and Langmuir-Blodgett films; thin-film surfaces and growth; chemistry and modification of surfaces and metal-semiconductor interfaces.
Successful transmission electron microscopy (TEM) experimentation depends on many things, one being specimen preparation. Whereas TEM samples of bulk metallic or ceramic materials can be prepared in a straightforward manner, the need to examine nonbulk and/or other classes of materials creates a need for more specialized preparation methods. This book from MRS, the fourth in a successful series, pioneers novel methods or ways of characterizing the specimen preparation process. Contributions to the book are tutorial in nature, and therefore somewhat longer than usual. Papers cover both general and materials-specific specimen preparation methods. Metallic, polymer, plastic, semiconducting, ceramic and magnetic materials as found in bulk, thin-film, dispersed and powdered forms are discussed.