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This book is unique in its in-depth coverage of heat transfer and fluid mechanics including numerical and computer methods, applications, thermodynamics and fluid mechanics. It will serve as a comprehensive resource for professional engineers well into the new millennium. Some of the material will be drawn from the "Handbook of Mechanical Engineering," but with expanded information in such areas as compressible flow and pumps, conduction, and desalination.
The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Thermal engineering is a sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy. The energy is transformed between two mediums. It can also be transferred into other forms of energy. Thermal engineering makes use of thermodynamics, which is a branch of physics that deals with heat and temperature. It involves the process of converting the generated energy from thermal sources into mechanical, chemical and electrical energy. Thermofluids is an associated field of thermal engineering. It draws on concepts from thermodynamics as well as thermal engineering. This book presents the complex subject of thermal engineering in the most comprehensible and easy to understand language. It explores all the important aspects of thermal engineering in the present day scenario. This book is appropriate for students seeking detailed information in this area as well as for experts.
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
This book is prepared to serve as a data handbook for the engineering students for the courses in Thermodynamics, Thermal Engineering, Refrigeration and Air-Conditioning, Heat and Mass Transfer, Energy systems and Non-Conventional Energy sources at the undergraduate and postgraduate level. The data complied in this book has been presented in SI units since all universities / Institutions are using SI units only. The text is divided in three parts. The first part deals with thermal science and includes steam tables, refrigerant properties, Mollier chart, p-h charts for various refrigerants and psychrometric chart. The second part deals with heat and mass transfer and includes the property values of materials-solids, liquids and gases-that are commonly used in heat transfer problems and the last part deals with solar radiation, flat and concentrated collectors.
An Emerging Tool for Pioneering Engineers Co-published by the International Federation of Heat Treatment and Surface Engineering.Thermal processing is a highly precise science that does not easily lend itself to improvements through modeling, as the computations required to attain an accurate prediction of the microstructure and properties of work
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Handbook of Thermal Conductivity of Liquids and Gases covers practically all of the data available on the thermalconductivity of pure liquids and gases. Thermal conductivity data included in the book is based on original experimental measurements and correlations recommended or adopted as a standard by the National Standard Reference Data Service of the Russian Federation. New tabulations of thermal conductivity data on high-molecular organic fluids and the alkali metals in both liquid and gaseous states are featured as well. This book will be an important reference for all researchers working in thermodynamics.