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It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
This is a thoroughly revised version of the original book published in 1986. About half of the contents of the previous version remain essentially unchanged, and one quarter has been rewritten and updated. The rest consists of completely new and extended material. Recent research has focussed on new materials made through "molecular engineering", and computational materials science through ab initio electron structure calculations. Another trend is the ever growing interdisciplinary aspect of both basic and applied materials science. There is an obvious need for reviews that link well established results to the modern approaches. One purpose of this book is to provide such an overview in a specific field of materials science, namely thermophysical phenomena that are intimately connected with the lattice vibrations of solids. This includes, e.g., elastic properties and electrical and thermal transport. Furthermore, this book attempts to present the results in such a form that the reader can clearly see their domain of applicability, for instance if and how they depend on crystal structure, defects, applied pressure, crystal anisotropy etc. The level and presentation is such that the results can be immediately used in research. Graduate students in condensed matter physics, metallurgy, inorganic chemistry or geophysical materials will benefit from this book as will theoretical physicists and scientists in industrial research laboratories.
It was seven years ago this month when I had the pleasure of writing the Foreword to the Proceedings of the Eighth Conference on Thermal Conductivity hosted by TPRC/ Purdue University in 1968. Since then this Conference has developed to the point where one can say it has just entered a new phase. At its meeting in June 1975, the Board of Governors of the International Thermal Conductivity Conferences passed a resolution which formalizes two main policies that were felt to be desirable for a number of years, A key item of the resolution was for CINDAS/Purdue University to become the permanent Sponsor of the Conferences and in this capacity assist the Conferences in all matters which will result in the effective implementation of its goals and mission. In short, CINDAS will serve as a home base for the Conferences thus providing continuity and a permanent point of contact. CINDAS/Purdue University is pleased to accept this respons ibility as it is well within its mission to promote the advancement and dissemination of knowledge on thermophysica! properties of matter. A second important aspect of the Conference resolution was the establishment of a policy to publish the Proceedings of future conferences on a continuing and uniform basis effective with this, the Fourteenth Conference.
This book is intended to provide a deep understanding on the advanced treatments of thermal properties of materials through experimental, theoretical, and computational techniques. This area of interest is being taught in most universities and institutions at the graduate and postgraduate levels. Moreover, the increasing modern technical and social interest in energy has made the study of thermal properties more significant and exciting in the recent years. This book shares with the international community a sense of global motivation and collaboration on the subject of thermal conductivity and its wide spread applications in modern technologies. This book presents new results from leading laboratories and researchers on topics including materials, thermal insulation, modeling, steady and transient measurements, and thermal expansion. The materials of interest range from nanometers to meters, bringing together ideas and results from across the research field.
This text provides a comprehensive introduction to infrared-transparent materials for windows and domes that must withstand harsh environmental conditions, such as high-speed flight or high temperature process monitoring. Introductory material in each section makes the book suitable for anyone with a background in science or engineering.