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This book is a monograph on the brittle fracture of ceramic materials, in a unified continuum, microstructural and atomistic treatment.
This book presents the theoretical concepts of stress and strain, as well as the strengthening and fracture mechanisms of engineering materials in an accessible level for non-expert readers, but without losing scientific rigor. This volume fills the gap between the specialized books on mechanical behavior, physical metallurgy and material science and engineering books on strength of materials, structural design and materials failure. Therefore it is intended for college students and practicing engineers that are learning for the first time the mechanical behavior and failure of engineering materials or wish to deepen their understanding on these topics. The book includes specific topics seldom covered in other books, such as: how to determine a state of stress, the relation between stress definition and mechanical design, or the theory behind the methods included in industrial standards to assess defects or to determine fatigue life. The emphasis is put into the link between scientific knowledge and practical applications, including solved problems of the main topics, such as stress and strain calculation. Mohr's Circle, yield criteria, fracture mechanics, fatigue and creep life prediction. The volume covers both the original findings in the field of mechanical behavior of engineering materials, and the most recent and widely accepted theories and techniques applied to this topic. At the beginning of some selected topics that by the author's judgement are transcendental for this field of study, the prime references are given, as well as a brief biographical semblance of those who were the pioneers or original contributors. Finally, the intention of this book is to be a textbook for undergraduate and graduate courses on Mechanical Behavior, Mechanical Metallurgy and Materials Science, as well as a consulting and/or training material for practicing engineers in industry that deal with mechanical design, materials selection, material processing, structural integrity assessment, and for researchers that incursion for the first time in the topics covered in this book.
From a leading expert in fracture mechanics, this text provides new approaches and new applications to advance the understanding of crack formation and propagation.
The Welding Engineer's Guide to Fracture and Fatigue provides an essential introduction to fracture and fatigue and the assessment of these failure modes, through to the level of knowledge that would be expected of a qualified welding engineer. Part one covers the basic principles of weld fracture and fatigue. It begins with a review of the design of engineered structures, provides descriptions of typical welding defects and how these defects behave in structures undergoing static and cyclical loading, and explains the range of failure modes. Part two then explains how to detect and assess defects using fitness for service assessment procedures. Throughout, the book assumes no prior knowledge and explains concepts from first principles. - Covers the basic principles of weld fracture and fatigue. - Reviews the design of engineered structures, provides descriptions of typical welding defects and how these defects behave in structures undergoing static and cyclical loading, and explains the range of failure modes. - Explains how to detect and assess defects using fitness for service assessment procedures.
This book is an interdisciplinary review of the effect of fracture on life, following the development of the understanding of fracture written from a historical perspective. After a short introduction to fracture, the first section of the book covers the effects of fracture on the evolution of the Earth, plants and animals, and man. The second section of the book covers the largely empirical control of fracture from ancient times to the end of the nineteenth century. The final section reviews the development of fracture theory as a discipline and its application during the twentieth century through to the present time./a
Marine Structural Design, Second Edition, is a wide-ranging, practical guide to marine structural analysis and design, describing in detail the application of modern structural engineering principles to marine and offshore structures. Organized in five parts, the book covers basic structural design principles, strength, fatigue and fracture, and reliability and risk assessment, providing all the knowledge needed for limit-state design and re-assessment of existing structures. Updates to this edition include new chapters on structural health monitoring and risk-based decision-making, arctic marine structural development, and the addition of new LNG ship topics, including composite materials and structures, uncertainty analysis, and green ship concepts. - Provides the structural design principles, background theory, and know-how needed for marine and offshore structural design by analysis - Covers strength, fatigue and fracture, reliability, and risk assessment together in one resource, emphasizing practical considerations and applications - Updates to this edition include new chapters on structural health monitoring and risk-based decision making, and new content on arctic marine structural design
June and Dec. issues contain listings of periodicals.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them