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This book is devoted to recent developments of instrumentation and measurement techniques applied to the aerospace field. It includes 23 selected papers from the 2019 IEEE International Workshop on Metrology for AeroSpace. Measurements are essential for obtaining a deeper knowledge of a phenomenon or an asset, as well as for making proper decisions and proposing new and efficient solutions, and this is especially true in environments as complex as aerospace. The research contributions included in the book can raise the interest of a wide group of researchers, operators and decision-makers from metrology and aerospace fields by presenting the most innovative solutions in this field from the scientific and technological points of view.
Issues for 1973- cover the entire IEEE technical literature.
This book contains extended and revised versions of the best papers presented at the 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, held in Cusco, Peru, in October 2019. The 15 full papers included in this volume were carefully reviewed and selected from the 28 papers (out of 82 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
This book highlights the latest advances in chemical and physical methods for thin-film deposition and surface engineering, including ion- and plasma-assisted processes, focusing on explaining the synthesis/processing–structure–properties relationship for a variety of thin-film systems. It covers topics such as advances in thin-film synthesis; new thin-film materials: diamond-like films, granular alloys, high-entropy alloys, oxynitrides, and intermetallic compounds; ultra-hard, wear- and oxidation-resistant and multifunctional coatings; superconducting, magnetic, semiconducting, and dielectric films; electrochemical and electroless depositions; thin-film characterization and instrumentation; and industrial applications.