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A thorough examination of lab-on-a-chip circuit-level operations to improve system performance A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. A standard complementary metal oxide semiconductor (CMOS) fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro-electro-mechanical systems, electronics, and electromagnetics. From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems Features concise analyses of the integration of microfluidics and micro-electro-mechanical systems Highlights the use of compressive sensing, super-resolution, and machine learning through the use of smart SoC processing Discusses recent advances in complementary metal oxide semiconductor-integrated lab-on-a-chip systems Includes guidance on DNA sequencing and cell counting applications using dual-mode chemical/optical and energy harvesting sensors The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field.* Presents the analysis and design principles of MEMS devices more systematically than ever before.* Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures* A problem section is included at the end of each chapter with answers provided at the end of the book.
This book presents the majority of the contributions to the Tenth German-Vietnamese Seminar on Physics and Engineering (GVS10) that took place in the Gustav- Stresemann-Institut (GSI) in Bonn from June 6 to June 9, 2007. In the focus of these studies are the preparation and basic properties of new material systems, related investigation methods, and practical applications. Accordingly the sections in this book are entitled electrons: transport and confinement, low-dimensional systems, magnetism, oxidic materials, organic films, new materials, and methods. The series of German-Vietnamese seminars was initiated and sponsored by the Gottlieb Daimler- and Karl Benz -Foundation since 1998 and took place alt- nately in both countries. These bilateral meetings brought together top-notch senior and junior Vietnamese scientists with German Scientists and stimulated many contacts and co-operations. Under the general title “Physics and Engine- ing” the programs covered, in the form of keynote-lectures, oral presentations and posters, experimental and theoretical cutting-edge material-physics oriented topics. The majority of the contributions was dealing with modern topics of material science, particularly nanoscience, which is a research field of high importance also in Vietnam. Modern material science allows a quick transfer of research results to technical applications, which is very useful for fast developing countries like Vietnam. On the other hand, the seminars took profit from the strong cro- fertilization of the different disciplines of physics. This book is dedicated to the tenth anniversary of the seminars and nicely shows the scientific progress in Vietnam and the competitive level reached.
Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.
Annotation Engineers and researchers can turn to this reference time and time again when they need to overcome challenges in design, simulation, fabrication, and application of MEMS (microelectromechanical systems) sensors.
The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.