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Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.