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This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR
The 52nd Purdue Industrial Waste Conference showcased 18 sessions on subjects such as biological aspects, physical-chemical aspects, oil and petroleum wastes, management and reuse strategies, international activities, and pollution prevention. This book compiles the work of nearly 200 international experts, covering the latest practical techniques, advanced research, new methods, actual operating data, and important case studies.
Combustion technology has traditionally been dominated by air/fuel combustion. However, two developments have increased the significance of oxygen-enhanced combustion - new technology producing oxygen less expensively and the increased importance of environmental regulations. Advantages of oxygen-enhanced combustion include numerous environmental benefits as well as increased energy efficiency and productivity. The text compiles information about using oxygen to enhance high temperature industrial heating and melting processes - serving as a unique resource for specialists implementing the use of oxygen in combustion systems; combustion equipment and industrial gas suppliers; researchers; funding agencies for advanced combustion technologies; and agencies developing regulations for safe, efficient, and environmentally friendly combustion systems. Oxygen-Enhanced Combustion: Examines the fundamentals of using oxygen in combustion, pollutant emissions, oxygen production, and heat transfer Describes ferrous and nonferrous metals, glass, and incineration Discusses equipment, safety, design, and fuels Assesses recent trends including stricter environmental regulations, lower-cost methods of producing oxygen, improved burner designs, and increasing fuel costs Emphasizing applications and basic principles, this book will act as the primary resource for mechanical, chemical, aerospace, and environmental engineers and scientists; physical chemists; fuel technologists; fluid dynamists; and combustion design engineers. Topics include: General benefits Economics Potential problems Pollutant emissions Oxygen production Adsorption Air separation Heat transfer Ferrous metals Melting and refining processes Nonferrous metals Minerals Glass furnaces Incineration Safety Handling and storage Equipment design Flow controls Fuels
The 80th Glass Problem Conference (GPC) was organized by the Kazuo Inamori School of Engineering, The New York State College of Ceramics, Alfred University, Alfred, NY 14802 and The Glass Manufacturing Industry Council (GMIC), Westerville, OH 43082. The Program Director was S. K. Sundaram, Inamori Professor of Materials Science and Engineering, Kazuo Inamori School of Engineering, The New York State College of Ceramics, Alfred University, Alfred, NY 14802. The Conference Director was Robert Weisenburger Lipetz, Executive Director, Glass Manufacturing Industry Council (GMIC), Westerville, OH 43082. The GPC Advisory Board (AB) included the Program Director, the Conference Director, and several industry representatives. The Board assembled the technical program. Donna Banks of the GMIC coordinated the events and provided support. The Conference started with a half-day plenary session followed by technical sessions. The themes and chairs of four technical sessions were as follows: Melting and Combustion Uyi Iyoha, Praxair, Inc., Peachtree City, GA, Jan Schep, Owens-Illinois, Inc., Perrysburg, OH, and Justin Wang, Guardian Industries, Auburn Hills, MI Batch, Environmental, and Modeling Phil Tucker, Johns Manville, Littleton, CO and Chris Tournour, Corning Inc., Corning, NY Refractories Larry McCloskey, Anchor Acquisition, LLC, Lancaster, OH and Eric Dirlam, Ardagh Group, Muncie, IN Sensors and Control Adam Polycn, Vitro Architectural Glass, Cheswick, PA and Glenn Neff, Glass Service USA, Inc., Stuart, FL
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging