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Data was gathered and analysis continued on seventeen process groups. Five process groups were completed. They include: solar cell test data acquisition, plasma etching of resist, laser trimming and holing operation, wafer surface preparation and wafer printing. Preliminary results to date show very promising results for other task groups. Silicon nitride antireflective coating equipment with modifications has high potential for low-cost automation. An electroless nickel plating system has been designed and is under construction to demonstrate the processing of 1500 wafers per hour. The conceptual design of two fully automated laser trimming and holing lines has been completed and has very promising low-cost, high volume potential. The spray-on dopant model equipment construction is nearly completed. Preliminary spray-on tests have shown very good results. Dopants can be sprayed on without wafer edge overlap and good dopant uniformity can be achieved. SAMICS has been applied to most process groups. It has been very effective in analyzing process steps for low-cost potential for meeting the LSA 1986 goals.