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Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Authoritative reference on the state of the art in the field with additional coverage of important foundational concepts Advances in Electromagnetics Empowered by Artificial Intelligence and Deep Learning presents cutting-edge research advances in the rapidly growing areas in optical and RF electromagnetic device modeling, simulation, and inverse-design. The text provides a comprehensive treatment of the field on subjects ranging from fundamental theoretical principles and new technological developments to state-of-the-art device design, as well as examples encompassing a wide range of related sub-areas. The content of the book covers all-dielectric and metallodielectric optical metasurface deep learning-accelerated inverse-design, deep neural networks for inverse scattering, applications of deep learning for advanced antenna design, and other related topics. To aid in reader comprehension, each chapter contains 10-15 illustrations, including prototype photos, line graphs, and electric field plots. Contributed to by leading research groups in the field, sample topics covered in Advances in Electromagnetics Empowered by Artificial Intelligence and Deep Learning include: Optical and photonic design, including generative machine learning for photonic design and inverse design of electromagnetic systems RF and antenna design, including artificial neural networks for parametric electromagnetic modeling and optimization and analysis of uniform and non-uniform antenna arrays Inverse scattering, target classification, and other applications, including deep learning for high contrast inverse scattering of electrically large structures Advances in Electromagnetics Empowered by Artificial Intelligence and Deep Learning is a must-have resource on the topic for university faculty, graduate students, and engineers within the fields of electromagnetics, wireless communications, antenna/RF design, and photonics, as well as researchers at large defense contractors and government laboratories.
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.
The book constitutes peer-reviewed proceedings of a workshop on Emerging Electronics Devices, Circuits, and Systems (EEDCS) held in conjunction with International Symposium on Devices, Circuits, and Systems (ISDCS 2022). The book focuses on the recent development in devices, circuits, and systems. It also discusses innovations, trends, practical challenges, and solutions adopted in device design, modeling, fabrication, characterization, and their circuit implementation with pertinent system applications. It will be useful for researchers, developers, engineers, academicians, and students.
This volume reflects the theme of the INFORMS 2004 Meeting in Denver: Back to OR Roots. Emerging as a quantitative approach to problem-solving in World War II, our founders were physicists, mathematicians, and engineers who quickly found peace-time uses. It is fair to say that Operations Research (OR) was born in the same incubator as computer science, and it has spawned many new disciplines, such as systems engineering, health care management, and transportation science. Although people from many disciplines routinely use OR methods, many scientific researchers, engineers, and others do not understand basic OR tools and how they can help them. Disciplines ranging from finance to bioengineering are the beneficiaries of what we do — we take an interdisciplinary approach to problem-solving. Our strengths are modeling, analysis, and algorithm design. We provide a quanti- tive foundation for a broad spectrum of problems, from economics to medicine, from environmental control to sports, from e-commerce to computational - ometry. We are both producers and consumers because the mainstream of OR is in the interfaces. As part of this effort to recognize and extend OR roots in future probl- solving, we organized a set of tutorials designed for people who heard of the topic and want to decide whether to learn it. The 90 minutes was spent addre- ing the questions: What is this about, in a nutshell? Why is it important? Where can I learn more? In total, we had 14 tutorials, and eight of them are published here.