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The adverse impacts from excess noise on human health and daily activities have accelerated at an alarming rate over the last few decades. This has prompted significant research into noise attenuation and mitigation of these unwanted effects. This book is a collection of works from eminent researchers from around the world, who address the aforementioned issues. It provides the most up-to-date information on current work being conducted in the field of noise pollution and is of value to a wide range of students, engineers, scientists and industry consultants who wish to further understand current methodologies and emerging concepts.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
This guidebook should be of interest to airport managers and other staff from airports of all sizes who are responsible for responding to neighboring communities regarding aircraft noise issues. It provides guidance on how best to improve communications with the public about issues related to aircraft noise exposure. Specifically, the guidebook presents best practices that characterize an effective communications program and provides basic information about noise and its abatement to assist in responding to public inquiries. It also suggests tools useful to initiate a new or upgrade an existing program of communication with public and private stakeholders about noise issues. An accompanying CD-ROM contains a toolkit with examples of material that has been successfully used to communicate information about noise, as well as numerous guidance documents about noise and communications that have seldom been brought together in the same resource.
This volume contains the contributions to the 9th International Workshop on Railway Noise, held Sept 04-08, 2007, in Munich, Germany. The workshop featured lectures by international leaders in the field of railway noise and vibration. All subjects relating to railway noise as noise sources (rolling noise, aerodynamic noise, bridge noise, sonic boom), prediction tools and theoretical models, new noise reduction, technology as well as ground-borne vibration are tackled.
This book reports on the 13th International Workshop on Railway Noise (IWRN13), held on September 16-20, 2019, in Ghent, Belgium. It gathers original peer-reviewed papers describing the latest developments in railway noise and vibration, as well as state-of-the-art reviews written by authoritative experts in the field. The different papers cover a broad range of railway noise and vibration topics, such as rolling noise, wheel squeal, noise perception, prediction methods, measurements and monitoring, and vehicle interior noise. Further topics include rail roughness, rail corrugation and grinding, high-speed rail and aerodynamic noise, structure-borne noise, ground-borne noise and vibration, and resilient track forms. Policy, criteria and regulation are also discussed. Offering extensive and timely information to both scientists and engineers, this book will help them in their daily efforts to identify, understand and solve problems related to railway noise and vibration, and to achieve the ultimate goal of reducing the environmental impact of railway systems.
Image processing integrates and extracts data from photos for a variety of uses. Applications for image processing are useful in many different disciplines. A few examples include remote sensing, space applications, industrial applications, medical imaging, and military applications. Imaging systems come in many different varieties, including those used for chemical, optical, thermal, medicinal, and molecular imaging. To extract the accurate picture values, scanning methods and statistical analysis must be used for image analysis. Thrust Technologies’ Effect on Image Processing provides insights into image processing and the technologies that can be used to enhance additional information within an image. The book is also a useful resource for researchers to grow their interest and understanding in the burgeoning fields of image processing. Covering key topics such as image augmentation, artificial intelligence, and cloud computing, this premier reference source is ideal for computer scientists, industry professionals, researchers, academicians, scholars, practitioners, instructors, and students.