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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected to gain an insightful view on the current trends, issues, mitigating factors as well as solutions from the book. This book consists of selected papers presented at the 2nd International Conference on Innovative Technology, Engineering and Sciences 2020 (iCITES) hosted virtually by Universiti Malaysia Pahang on 22nd December 2020. iCITES is a biennial conference, aimed at building a platform that allows relevant stakeholders to share and discuss their latest researches, ideas and survey reports from theoretical to a practical standpoint especially in the Innovative Robotics & Automation and Data Analytics tracks which was published in this book.
The last few decades have seen huge developments in the use of concentrated solar power plants, communications technologies (mobile telephony and 5G networks), the nuclear sector with its small modular reactors and concentrated solar power stations. These developments have called for a new generation of heat exchangers. As well as presenting conventional heat exchangers (shell-and-tube and plate heat exchangers), their design techniques and calculation algorithms, Heat Exchangers introduces new-generation compact heat exchangers, including printed circuit heat exchangers, plate-fin heat exchangers, spiral heat exchangers, cross-flow tube-fin heat exchangers, phase-change micro-exchangers, spray coolers, heat pipe heat exchangers and evaporation chambers. This new generation of heat exchangers is currently undergoing a boom, with applications in on-board equipment in aircraft, locomotives, space shuttles and mobile phones, where the volume of the equipment is one of the most important design parameters.
The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy production. As such, it is essential to emphasize energy recovery systems to improve heat transfer in thermal processes. Currently, significant research efforts are being conducted to expose criteria and analysis techniques for the design of heat exchange equipment. This book discusses optimization of heat exchangers, heat transfer in novel working fluids, and the experimental and numerical analysis of heat transfer applications.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
This fully updated textbook provides complete coverage of electrical circuits and introduces students to the field of energy conversion technologies, analysis and design. Chapters are designed to equip students with necessary background material in such topics as devices, switching circuit analysis techniques, converter types, and methods of conversion. The book contains a large number of examples, exercises, and problems to help enforce the material presented in each chapter. A detailed discussion of resonant and softswitching dc-to-dc converters is included along with the addition of new chapters covering digital control, non-linear control, and micro-inverters for power electronics applications. Designed for senior undergraduate and graduate electrical engineering students, this book provides students with the ability to analyze and design power electronic circuits used in various industrial applications.
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.
This book is a definitive introduction to models of computation for the design of complex, heterogeneous systems. It has a particular focus on cyber-physical systems, which integrate computing, networking, and physical dynamics. The book captures more than twenty years of experience in the Ptolemy Project at UC Berkeley, which pioneered many design, modeling, and simulation techniques that are now in widespread use. All of the methods covered in the book are realized in the open source Ptolemy II modeling framework and are available for experimentation through links provided in the book. The book is suitable for engineers, scientists, researchers, and managers who wish to understand the rich possibilities offered by modern modeling techniques. The goal of the book is to equip the reader with a breadth of experience that will help in understanding the role that such techniques can play in design.