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Papers from a November 2001 conference describe recent developments in the field, related to areas including fusion welding, solid state welding, and brazing as applied to both ceramic and metallic materials. Papers are in sections on laser welding technologies and characterization, brazing and sold
The general themes of the 37 papers are brazing, welding, microjoining, and various other joining technologies; joint properties; microstructural characteristics; the science and technology of interfaces;, ceramic-metal joints; wetting and diffusion; and specific examples of successful applications.
Twenty-three papers from the October 1998 conference. Papers discuss such advanced and specialty materials technologies for high performance under severe environmental and temperature conditions and for the construction of large and intricate shapes. The main topics addressed include joining techniq
ISEPD-4 Proceedings of the 4th International Sympsoium on Eco-Materials Processing & Design, Gyungpodae, Korea, February 4-6, 2003
Joining remains an enabling technology in several key areas related to the use of ceramics. Development of ceramic materials for electronic, biomedical, power generation, and many other fields continues at a rapid pace. Joining of ceramics is a critical issue in the integration of ceramic components in engineering design. This book includes reviews on the state-of-the-art in ceramic joining, new joining materials and methods, and modeling joint behavior and properties. Proceedings of the symposium held at the 104th Annual Meeting of The American Ceramic Society, April 28-May1, 2002 in Missouri; Ceramic Transactions, Volume 138
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.