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Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
This comprehensive book on application-specific integrated circuits (ASICs) describes the latest methods in VLSI-systems design. ASIC design, using commercial tools and pre-designed cell libraries, is the fastest, most cost-effective, and least error-prone method of IC design. As a consequence, ASICs and ASIC-design methods have become increasingly popular in industry for a wide range of applications. The book covers both semicustom and programmable ASIC types. After describing the fundamentals of digital logic design and the physical features of each ASIC type, the book turns to ASIC logic design - design entry, logic synthesis, simulation, and test - and then to physical design - partitioning, floorplanning, placement, and routing. You will find here, in practical well-explained detail, everything you need to know to understand the design of an ASIC, and everything you must do to begin and to complete your own design. Features Broad coverage includes, in one information-packed volume, cell-based ICs, gate arrays, field-programmable gate arrays (FPGAs), and complex programmable logic devices (PLDs). Examples throughout the book have been checked with a wide range of commercial tools to ensure their accuracy and utility. Separate chapters and appendixes on both Verilog and VHDL, including material from IEEE standards, serve as a complete reference for high-level, ASIC-design entry. As in other landmark VLSI books published by Addison-Wesley - from Mead and Conway to Weste and Eshraghian - the author's teaching expertise and industry experience illuminate the presentation of useful design methods. Any engineer, manager, or student who is working with ASICs in a design project, or who is simply interested in knowing more about the different ASIC types and design styles, will find this book to be an invaluable resource, reference, and guide.
This graduate-level textbook presents the principles, design methods, simulation, and materials of photonic circuits. It provides state-of-the-art examples of silicon, indium phosphide, and other materials frequently used in these circuits, and includes a thorough discussion of all major types of devices. In addition, the book discusses the integrated photonic circuits (chips) that are currently increasingly employed on the international technology market in connection with short-range and long-range data communication. Featuring references from the latest research in the field, as well as chapter-end summaries and problem sets, Principles of Photonic Integrated Circuits is ideal for any graduate-level course on integrated photonics, or optical technology and communication.
The fourth edition of CMOS Digital Integrated Circuits: Analysis and Design continues the well-established tradition of the earlier editions by offering the most comprehensive coverage of digital CMOS circuit design, as well as addressing state-of-the-art technology issues highlighted by the widespread use of nanometer-scale CMOS technologies. In this latest edition, virtually all chapters have been re-written, the transistor model equations and device parameters have been revised to reflect the sigificant changes that must be taken into account for new technology generations, and the material has been reinforced with up-to-date examples. The broad-ranging coverage of this textbook starts with the fundamentals of CMOS process technology, and continues with MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, arithmetic building blocks, clock and I/O circuits, low power design techniques, design for manufacturability and design for testability.
The third edition of Hodges and Jackson’s Analysis and Design of Digital Integrated Circuits has been thoroughly revised and updated by a new co-author, Resve Saleh of the University of British Columbia. The new edition combines the approachability and concise nature of the Hodges and Jackson classic with a complete overhaul to bring the book into the 21st century. The new edition has replaced the emphasis on BiPolar with an emphasis on CMOS. The outdated MOS transistor model used throughout the book will be replaced with the now standard deep submicron model. The material on memory has been expanded and updated. As well the book now includes more on SPICE simulation and new problems that reflect recent technologies. The emphasis of the book is on design, but it does not neglect analysis and has as a goal to provide enough information so that a student can carry out analysis as well as be able to design a circuit. This book provides an excellent and balanced introduction to digital circuit design for both students and professionals.
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
The striking feature of this book is its coverage of the upper GHz domain. However, the latest technologies, applications and broad range of circuits are discussed. Design examples are provided including cookbook-like optimization strategies. This state-of-the-art book is valuable for researchers as well as for engineers in industry. Furthermore, the book serves as fruitful basis for lectures in the area of IC design.
"An ideal text-reference for professionals and students in electrical engineering, electro-optic engineering, and computer chip design..."--back cover.
Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.