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A union list of serials commencing publication after Dec. 31, 1949.
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
CSIE 2011 is an international scientific Congress for distinguished scholars engaged in scientific, engineering and technological research, dedicated to build a platform for exploring and discussing the future of Computer Science and Information Engineering with existing and potential application scenarios. The congress has been held twice, in Los Angeles, USA for the first and in Changchun, China for the second time, each of which attracted a large number of researchers from all over the world. The congress turns out to develop a spirit of cooperation that leads to new friendship for addressing a wide variety of ongoing problems in this vibrant area of technology and fostering more collaboration over the world. The congress, CSIE 2011, received 2483 full paper and abstract submissions from 27 countries and regions over the world. Through a rigorous peer review process, all submissions were refereed based on their quality of content, level of innovation, significance, originality and legibility. 688 papers have been accepted for the international congress proceedings ultimately.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
This six-volume set presents cutting-edge advances and applications of expert systems. Because expert systems combine the expertise of engineers, computer scientists, and computer programmers, each group will benefit from buying this important reference work. An "expert system" is a knowledge-based computer system that emulates the decision-making ability of a human expert. The primary role of the expert system is to perform appropriate functions under the close supervision of the human, whose work is supported by that expert system. In the reverse, this same expert system can monitor and double check the human in the performance of a task. Human-computer interaction in our highly complex world requires the development of a wide array of expert systems. Expert systems techniques and applications are presented for a diverse array of topics including Experimental design and decision support The integration of machine learning with knowledge acquisition for the design of expert systems Process planning in design and manufacturing systems and process control applications Knowledge discovery in large-scale knowledge bases Robotic systems Geograhphic information systems Image analysis, recognition and interpretation Cellular automata methods for pattern recognition Real-time fault tolerant control systems CAD-based vision systems in pattern matching processes Financial systems Agricultural applications Medical diagnosis
Process Intensification: Faster, Better, Cheaper presents basic concepts and applications of process intensification (PI) and links their common effects across processes. It defines two fundamental parameters, PI factor, and Cost Impact (CI) factor, and uses these to analyze various applications where Process Intensification has been carried out. Process Intensification principles have, in the past, been applied to diverse fields, ranging from biodiesel production to offshore processing, and this book unifies these aspects to identify the common factors that drive process enhancements. Each chapter investigates a specific application, discusses the key PI principles, and includes problem sets and examples. The book also provides case studies and realworld examples throughout the chapters. Features: Explores Cost Impact of Process Intensification, and their relative magnitudes, as a universal metric Covers a range of industrial applications, including heat and mass transfer, atomization and comminution, and enhanced oil recovery Discusses the application of Process Intensification for clean coal technology and environmental remediation Includes end-of-chapter problems, examples, and case studies The book is intended for senior undergraduate chemical and mechanical engineering students taking courses in Process Design, Process Optimization, Process Synthesis, and Process Intensification. Instructors will be able to utilize a Solutions Manual and Lecture Slides for their course. The eBook+ version includes the following enhancements: Open-ended essay questions to encourage conceptual thinking and apply new information Pop-up explanations of selected concepts and terms throughout the chapters Interactive definition flashcards that summarize key takeaways at the end of the chapter Quizzes within chapters to help readers refresh their knowledge