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Electromagnetic materials have both civilian and defence applications, such as novel antenna designs and protection against high power transients in densely packed printed circuits. For certain applications, the materials may be required to have special frequency response or polarization response to meet the component or system specifications. An in-depth understanding of the responses of materials to electromagnetic waves may even enable us to design and fabricate materials with properties not found in nature.This book constitutes the proceedings of the Symposium on Electromagnetic Materials, which provided a forum for scientists and engineers to report the latest research findings, to exchange ideas and information, and to establish research links.

ICMAT 2003

International Conference on Materials for Advanced Technologies. 2, 2003, Singapore

Published: 2004

Total Pages: 10


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Annotation Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT), Symposium F: Electromagnetic Materials, held in Singapore from December 7-12, 2003.
This volume comprises the main ideas and the latest results in the study of electromagnetic materials, as presented at the Symposium on Electromagnetic Materials, ICMAT 2005.The high quality contributions reflect the principle aims of the conference: to provide an international forum for scientists and engineers to report their most recent research findings, to exchange ideas and information, and to nuture and establish research ties. Electromagnetic materials have both civilian and defence applications, such as novel antenna designs, protection against high power transients in densely packed printed circuits, and special frequency response or polarization response to meet component or system specifications. An in-depth understanding of the responses of materials to electromagnetic waves may even enable us to design and fabricate materials with properties not found in nature.
The contributions to this volume deliberate the electrical and magnetic properties of materials relevant to the design of unconventional antennas, microwave circuits/components, anti-reflection media and coatings, EMI shielding structures, radomes, etc. Though a classical research topic, some recent advancements in technology have led to new capabilities to create and control fine-scale structures. This has inspired scientists to develop new materials with exceptionally high permittivity or permeability, as well as metamaterials (or negative index materials) with unusual electromagnetic properties. Novel materials based on the use of active devices to control their electromagnetic performance have also been proposed. The multi-disciplinary nature of these new materials has brought together researchers from materials science, physics and electrical engineering to explore and deepen our current understanding of electromagnetic wave propagation. A wide range of new commercial/defence applications of these materials is expected to emerge in the near future.
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Contributed papers of the workshop held at IIT, Madras, in 2003.