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Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.
This proceeding constitutes the thoroughly refereed proceedings of the 1st International Conference on Combinatorial and Optimization, ICCAP 2021, December 7-8, 2021. This event was organized by the group of Professors in Chennai. The Conference aims to provide the opportunities for informal conversations, have proven to be of great interest to other scientists and analysts employing these mathematical sciences in their professional work in business, industry, and government. The Conference continues to promote better understanding of the roles of modern applied mathematics, combinatorics, and computer science to acquaint the investigator in each of these areas with the various techniques and algorithms which are available to assist in his or her research. We selected 257 papers were carefully reviewed and selected from 741 submissions. The presentations covered multiple research fields like Computer Science, Artificial Intelligence, internet technology, smart health care etc., brought the discussion on how to shape optimization methods around human and social needs.
Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.
Dielectrics in Electric Fields explores the influence of electric fields on dielectric—i.e., non-conducting or insulating—materials, examining the distinctive behaviors of these materials through well-established principles of physics and engineering. Featuring five new chapters, nearly 200 new figures, and more than 800 new citations, this fully updated and significantly expanded Second Edition: Analyzes inorganic substances with real-life applications in harsh working conditions such as outdoor, nuclear, and space environments Introduces methods for measuring dielectric properties at microwave frequencies, presenting results obtained for specific materials Discusses the application of dielectric theory in allied fields such as corrosion studies, civil engineering, and health sciences Combines in one chapter coverage of electrical breakdown in gases with breakdown in micrometric gaps Offers extensive coverage of electron energy distribution—essential knowledge required for the application of plasma sciences in medical science Delivers a detailed review of breakdown in liquids, along with an overview of electron mobility, providing a clear understanding of breakdown phenomena Explains breakdown in solid dielectrics such as single crystals, polycrystalline and amorphous states, thin films, and powders compressed to form pellets Addresses the latest advances in dielectric theory and research, including cutting-edge nanodielectric materials and their practical applications Blends early classical papers that laid the foundation for much of the dielectric theory with more recent work The author has drawn from more than 55 years of research studies and experience in the areas of high-voltage engineering, power systems, and dielectric materials and systems to supply both aspiring and practicing engineers with a comprehensive, authoritative source for up-to-date information on dielectrics in electric fields.
In recent years, multicomponent polymers have generated much interest due to their excellent properties, unique morphology and high-end applications. Book focusses on thermal, thermo-mechanical and dielectric analysis of polymers and multicomponent polymeric systems like blends, interpenetrating polymeric networks (IPNs), gels, polymer composites, nanocomposites. Through these analyses, it provides an insight into the stability of polymer systems as a function of time, processing and usage. Aimed at polymer chemists, physicists and engineers, it also covers ASTM /ISO and other standards of various measurement techniques for systematic analysis in materials science.
Proceedings of the Third China International Conference on High-Performance Ceramics (CICC-3), Shenzhen, China, May 9-12, 2004
Vol. 1: Semiconductors;Vol. 2: Semiconductors Devices;Vol. 3: High-Tc Superconductors and Organic Conductors; Vol. 4: Ferroelectrics and Dielectrics; Vol. 5: Chalcogenide Glasses and Sol-Gel Materials; Vol. 6 Nanostructured Materials; Vol. 7: Liquid Crystals, Display and Laser Materials; Vol. 8: Conducting Polymers; Vol. 9: Nonlinear Optical Materials; Volume 10: Light-Emitting Diodes, Lithium Batteries and Polymer Devices