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Oxide-dispersion strengthened copper alloys and a precipitation-hardened copper-nickel-beryllium alloy showed a significant reduction in toughness at elevated temperature (250°C). This decrease in toughness was much larger than would be expected from the relatively modest changes in the tensile properties over the same temperature range. However, a copper-chromium-zirconium alloy strengthened by precipitation showed only a small decrease in toughness at the higher temperatures. The embrittled alloys showed a transition in fracture mode, from transgranular microvoid coalescence at room temperature to intergranular with localized ductility at high temperatures. The Cu-Cr-Zr alloy maintained the ductile microvoid coalescence failure mode at all test temperatures.
Copper has been used for thousands of years. In the centuries, both handicraft and industry have taken advantage of its easy castability and remarkable ductility combined with good mechanical and corrosion resistance. Although its mechanical properties are now well known, the simple f.c.c. structure still makes copper a model material for basic studies of deformation and damage mechanism in metals. On the other hand, its increasing use in many industrial sectors stimulates the development of high-performance and high-efficiency copper-based alloys. After an introduction to classification and casting, this book presents modern techniques and trends in processing copper alloys, such as the developing of lead-free alloys and the role of severe plastic deformation in improving its tensile and fatigue strength. Finally, in a specific section, archaeometallurgy techniques are applied to ancient copper alloys. The book is addressed to engineering professionals, manufacturers and materials scientists.
This books presents current research in the study of the preparation, properties and applications of copper alloys. Topics discussed include the electrodeposition of copper based alloys for giant magneto resistance applications; the mechanical properties of copper under dynamic load; copper alloy micro-structures for application in microreactors and high strength copper-based conductor materials.