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The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
The IEMT is an international forum for presenting research, development and applications of manufacturing technology and systems for use in the manufacture of electronic components, assemblies, and systems.
This text on electronics manufacturing technology covers such topics as: new materials, including substrates, metallization, encapsulants and fatigue-resistant solder; test and reliability; thermal management; mechantronics; MCMs; sensors; and flip chip in automotive use.