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Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.