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Broad coverage of digital product creation, from design to manufacture and process optimization This book addresses the need to provide up-to-date coverage of current CAD/CAM usage and implementation. It covers, in one source, the entire design-to-manufacture process, reflecting the industry trend to further integrate CAD and CAM into a single, unified process. It also updates the computer aided design theory and methods in modern manufacturing systems and examines the most advanced computer-aided tools used in digital manufacturing. Computer Aided Design and Manufacturing consists of three parts. The first part on Computer Aided Design (CAD) offers the chapters on Geometric Modelling; Knowledge Based Engineering; Platforming Technology; Reverse Engineering; and Motion Simulation. The second part on Computer Aided Manufacturing (CAM) covers Group Technology and Cellular Manufacturing; Computer Aided Fixture Design; Computer Aided Manufacturing; Simulation of Manufacturing Processes; and Computer Aided Design of Tools, Dies and Molds (TDM). The final part includes the chapters on Digital Manufacturing; Additive Manufacturing; and Design for Sustainability. The book is also featured for being uniquely structured to classify and align engineering disciplines and computer aided technologies from the perspective of the design needs in whole product life cycles, utilizing a comprehensive Solidworks package (add-ins, toolbox, and library) to showcase the most critical functionalities of modern computer aided tools, and presenting real-world design projects and case studies so that readers can gain CAD and CAM problem-solving skills upon the CAD/CAM theory. Computer Aided Design and Manufacturing is an ideal textbook for undergraduate and graduate students in mechanical engineering, manufacturing engineering, and industrial engineering. It can also be used as a technical reference for researchers and engineers in mechanical and manufacturing engineering or computer-aided technologies.
Selected, peer reviewed papers from the 2nd International Conference on Computer-Aided Design, Manufacturing, Modeling and Simulation (CDMMS 2012), September 21-23, 2012, Chongqing, China
Responding to recent developments and a growing VLSI circuit manufacturing market, Technology Computer Aided Design: Simulation for VLSI MOSFET examines advanced MOSFET processes and devices through TCAD numerical simulations. The book provides a balanced summary of TCAD and MOSFET basic concepts, equations, physics, and new technologies related to TCAD and MOSFET. A firm grasp of these concepts allows for the design of better models, thus streamlining the design process, saving time and money. This book places emphasis on the importance of modeling and simulations of VLSI MOS transistors and TCAD software. Providing background concepts involved in the TCAD simulation of MOSFET devices, it presents concepts in a simplified manner, frequently using comparisons to everyday-life experiences. The book then explains concepts in depth, with required mathematics and program code. This book also details the classical semiconductor physics for understanding the principle of operations for VLSI MOS transistors, illustrates recent developments in the area of MOSFET and other electronic devices, and analyzes the evolution of the role of modeling and simulation of MOSFET. It also provides exposure to the two most commercially popular TCAD simulation tools Silvaco and Sentaurus. • Emphasizes the need for TCAD simulation to be included within VLSI design flow for nano-scale integrated circuits • Introduces the advantages of TCAD simulations for device and process technology characterization • Presents the fundamental physics and mathematics incorporated in the TCAD tools • Includes popular commercial TCAD simulation tools (Silvaco and Sentaurus) • Provides characterization of performances of VLSI MOSFETs through TCAD tools • Offers familiarization to compact modeling for VLSI circuit simulation R&D cost and time for electronic product development is drastically reduced by taking advantage of TCAD tools, making it indispensable for modern VLSI device technologies. They provide a means to characterize the MOS transistors and improve the VLSI circuit simulation procedure. The comprehensive information and systematic approach to design, characterization, fabrication, and computation of VLSI MOS transistor through TCAD tools presented in this book provides a thorough foundation for the development of models that simplify the design verification process and make it cost effective.
This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of major state-of-the-art stress- and strain-engineered advanced semiconductor devices: MOSFETs, BJTs, HBTs, nonclassical MOS devices, finFETs, silicon-germanium hetero-FETs, solar cells, power devices, and memory devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. The book also offers an innovative and new approach to teaching the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. To extend the role of TCAD in today’s advanced technology era, process compact modeling and DFM issues have been included for design–technology interface generation. Unique in approach, this book provides an integrated view of silicon technology and beyond—with emphasis on TCAD simulations. It is the first book to provide a web-based online laboratory for semiconductor device characterization and SPICE parameter extraction. It describes not only the manufacturing practice associated with the technologies used but also the underlying scientific basis for those technologies. Written from an engineering standpoint, this book provides the process design and simulation background needed to understand new and future technology development, process modeling, and design of nanoscale transistors. The book also advances the understanding and knowledge of modern IC design via TCAD, improves the quality in micro- and nanoelectronics R&D, and supports the training of semiconductor specialists. It is intended as a textbook or reference for graduate students in the field of semiconductor fabrication and as a reference for engineers involved in VLSI technology development who have to solve device and process problems. CAD specialists will also find this book useful since it discusses the organization of the simulation system, in addition to presenting many case studies where the user applies TCAD tools in different situations.
The European Symposium on Computer Aided Process Engineering (ESCAPE) series presents the latest innovations and achievements of leading professionals from the industrial and academic communities. The ESCAPE series serves as a forum for engineers, scientists, researchers, managers and students to present and discuss progress being made in the area of computer aided process engineering (CAPE). European industries large and small are bringing innovations into our lives, whether in the form of new technologies to address environmental problems, new products to make our homes more comfortable and energy efficient or new therapies to improve the health and well being of European citizens. Moreover, the European Industry needs to undertake research and technological initiatives in response to humanity's "Grand Challenges," described in the declaration of Lund, namely, Global Warming, Tightening Supplies of Energy, Water and Food, Ageing Societies, Public Health, Pandemics and Security. Thus, the Technical Theme of ESCAPE 21 will be "Process Systems Approaches for Addressing Grand Challenges in Energy, Environment, Health, Bioprocessing & Nanotechnologies."
In the competitive business arena companies must continually strive to create new and better products faster, more efficiently, and more cost effectively than their competitors to gain and keep the competitive advantage. Computer-aided design (CAD), computer-aided engineering (CAE), and computer-aided manufacturing (CAM) are now the industry standa
The 31st European Symposium on Computer Aided Process Engineering: ESCAPE-31, Volume 50 contains the papers presented at the 31st European Symposium of Computer Aided Process Engineering (ESCAPE) event held in Istanbul, Turkey. It is a valuable resource for chemical engineers, chemical process engineers, researchers in industry and academia, students and consultants in the chemical industries. - Presents findings and discussions from the 31st European Symposium of Computer Aided Process Engineering (ESCAPE) event
Computer Aided Geometric Design covers the proceedings of the First International Conference on Computer Aided Geometric Design, held at the University of Utah on March 18-21, 1974. This book is composed of 15 chapters and starts with reviews of the properties of surface patch equation and the use of computers in geometrical design. The next chapters deal with the principles of smooth interpolation over triangles and without twist constraints, as well as the graphical representation of surfaces over triangles and rectangles. These topics are followed by discussions of the B-spline curves and surfaces; mathematical and practical possibilities of UNISURF; nonlinear splines; and some piecewise polynomial alternatives to splines under tension. Other chapters explore the smooth parametric surfaces, the space curve as a folded edge, and the interactive computer graphics application of the parametric bi-cubic surface to engineering design problems. The final chapters look into the three-dimensional human-machine communication and a class of local interpolating splines. This book will prove useful to design engineers.
Manufacturing, reduced to its simplest form, involves the sequencing of product forms through a number of different processes. Each individual step, known as an unit manufacturing process, can be viewed as the fundamental building block of a nation's manufacturing capability. A committee of the National Research Council has prepared a report to help define national priorities for research in unit processes. It contains an organizing framework for unit process families, criteria for determining the criticality of a process or manufacturing technology, examples of research opportunities, and a prioritized list of enabling technologies that can lead to the manufacture of products of superior quality at competitive costs. The study was performed under the sponsorship of the National Science Foundation and the Defense Department's Manufacturing Technology Program.
Shape interrogation is the process of extraction of information from a geometric model. It is a fundamental component of Computer Aided Design and Manufacturing (CAD/CAM) systems. The authors focus on shape interrogation of geometric models bounded by free-form surfaces. Free-form surfaces, also called sculptured surfaces, are widely used in the bodies of ships, automobiles and aircraft, which have both functionality and attractive shape requirements. Many electronic devices as well as consumer products are designed with aesthetic shapes, which involve free-form surfaces. This book provides the mathematical fundamentals as well as algorithms for various shape interrogation methods including nonlinear polynomial solvers, intersection problems, differential geometry of intersection curves, distance functions, curve and surface interrogation, umbilics and lines of curvature, geodesics, and offset curves and surfaces. This book will be of interest both to graduate students and professionals.