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CMOS Processors and Memories addresses the-state-of-the-art in integrated circuit design in the context of emerging computing systems. New design opportunities in memories and processor are discussed. Emerging materials that can take system performance beyond standard CMOS, like carbon nanotubes, graphene, ferroelectrics and tunnel junctions are explored. CMOS Processors and Memories is divided into two parts: processors and memories. In the first part we start with high performance, low power processor design, followed by a chapter on multi-core processing. They both represent state-of-the-art concepts in current computing industry. The third chapter deals with asynchronous design that still carries lots of promise for future computing needs. At the end we present a “hardware design space exploration” methodology for implementing and analyzing the hardware for the Bayesian inference framework. This particular methodology involves: analyzing the computational cost and exploring candidate hardware components, proposing various custom architectures using both traditional CMOS and hybrid nanotechnology CMOL. The first part concludes with hybrid CMOS-Nano architectures. The second, memory part covers state-of-the-art SRAM, DRAM, and flash memories as well as emerging device concepts. Semiconductor memory is a good example of the full custom design that applies various analog and logic circuits to utilize the memory cell’s device physics. Critical physical effects that include tunneling, hot electron injection, charge trapping (Flash memory) are discussed in detail. Emerging memories like FRAM, PRAM and ReRAM that depend on magnetization, electron spin alignment, ferroelectric effect, built-in potential well, quantum effects, and thermal melting are also described. CMOS Processors and Memories is a must for anyone serious about circuit design for future computing technologies. The book is written by top notch international experts in industry and academia. It can be used in graduate course curriculum.
Timing, memory, power dissipation, testing, and testability are all crucial elements of VLSI circuit design. In this volume culled from the popular VLSI Handbook, experts from around the world provide in-depth discussions on these and related topics. Stacked gate, embedded, and flash memory all receive detailed treatment, including their power cons
This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
The Second Edition of The Cache Memory Book introduces systems designers to the concepts behind cache design. The book teaches the basic cache concepts and more exotic techniques. It leads readers through someof the most intricate protocols used in complex multiprocessor caches. Written in an accessible, informal style, this text demystifies cache memory design by translating cache concepts and jargon into practical methodologies and real-life examples. It also provides adequate detail to serve as a reference book for ongoing work in cache memory design. The Second Edition includes an updated and expanded glossary of cache memory terms and buzzwords. The book provides new real world applications of cache memory design and a new chapter on cache"tricks". Illustrates detailed example designs of caches Provides numerous examples in the form of block diagrams, timing waveforms, state tables, and code traces Defines and discusses more than 240 cache specific buzzwords, comparing in detail the relative merits of different design methodologies Includes an extensive glossary, complete with clear definitions, synonyms, and references to the appropriate text discussions
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
A survey of architectural mechanisms and implementation techniques for exploiting fine- and coarse-grained parallelism within microprocessors. Beginning with a review of past techniques, the monograph provides a comprehensive account of state-of-the-art techniques used in microprocessors, covering both the concepts involved and implementations in sample processors. The whole is rounded off with a thorough review of the research techniques that will lead to future microprocessors. XXXXXXX Neuer Text This monograph surveys architectural mechanisms and implementation techniques for exploiting fine-grained and coarse-grained parallelism within microprocessors. It presents a comprehensive account of state-of-the-art techniques used in microprocessors that covers both the concepts involved and possible implementations. The authors also provide application-oriented methods and a thorough review of the research techniques that will lead to the development of future processors.
The evolution of Si-based optoelectronics has been extremely fast in the last few years and it is predicted that this growth will still continue in the near future. The aim of the volume is to present different Si-based luminescing materials as porous silicon, rare-earth doped silicon, Si nanocrystals, silicides, Si-based multilayers and silicon-germanium alloy or superlattice structures. The different devices needed for an all-Si-based optoelectronics are treated, ranging from light sources to waveguides, from amplifiers and modulators to detectors. Both the very basic treatments as well as applications to real prototype devices and integration in an optical integrated circuit are presented. Several issues are highlighted: the problem of electrical transport in low-dimensional Si systems, the possibility of gain in Si-based systems, the low modulation speed of Si-based LEDs. The book gives a fascinating picture of the state-of-the-art in Si microphotonics and a perspective on what one can expect in the near future.
Modeling Microprocessor Performance focuses on the development of a design and evaluation tool, named RIPE (Rensselaer Interconnect Performance Estimator). This tool analyzes the impact on wireability, clock frequency, power dissipation, and the reliability of single chip CMOS microprocessors as a function of interconnect, device, circuit, design and architectural parameters. It can accurately predict the overall performance of existing microprocessor systems. For the three major microprocessor architectures, DEC, PowerPC and Intel, the results have shown agreement within 10% on key parameters. The models cover a broad range of issues that relate to the implementation and performance of single chip CMOS microprocessors. The book contains a detailed discussion of the various models and the underlying assumptions based on actual design practices. As such, RIPE and its models provide an insightful tool into single chip microprocessor design and its performance aspects. At the same time, it provides design and process engineers with the capability to model, evaluate, compare and optimize single chip microprocessor systems using advanced technology and design techniques at an early design stage without costly and time consuming implementation. RIPE and its models demonstrate the factors which must be considered when estimating tradeoffs in device and interconnect technology and architecture design on microprocessor performance.
Digital business has been driving the transformation of underlying IT infrastructure to be more efficient, secure, adaptive, and integrated. Information Technology (IT) must be able to handle the explosive growth of mobile clients and employees. IT also must be able to use enormous amounts of data to provide deep and real-time insights to help achieve the greatest business impact. This IBM® Redbooks® publication addresses the IBM Mainframe, the IBM z13TM. The IBM z13 is the trusted enterprise platform for integrating data, transactions, and insight. A data-centric infrastructure must always be available with a 99.999% or better availability, have flawless data integrity, and be secured from misuse. It needs to be an integrated infrastructure that can support new applications. It needs to have integrated capabilities that can provide new mobile capabilities with real-time analytics delivered by a secure cloud infrastructure. IBM z13 is designed with improved scalability, performance, security, resiliency, availability, and virtualization. The superscalar design allows the z13 to deliver a record level of capacity over the prior IBM z SystemsTM. In its maximum configuration, z13 is powered by up to 141 client characterizable microprocessors (cores) running at 5 GHz. This configuration can run more than 110,000 millions of instructions per second (MIPS) and up to 10 TB of client memory. The IBM z13 Model NE1 is estimated to provide up to 40% more total system capacity than the IBM zEnterprise® EC12 (zEC1) Model HA1. This book provides information about the IBM z13 and its functions, features, and associated software support. Greater detail is offered in areas relevant to technical planning. It is intended for systems engineers, consultants, planners, and anyone who wants to understand the IBM z Systems functions and plan for their usage. It is not intended as an introduction to mainframes. Readers are expected to be generally familiar with existing IBM z Systems technology and terminology.