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The rapid increase in new power electronic devices and converters for electric transportation and smart grid technologies requires a deep analysis of their component performances, considering all of the different environmental scenarios, overload conditions, and high stress operations. Therefore, evaluation of the reliability and availability of these devices becomes fundamental both from technical and economical points of view. The rapid evolution of technologies and the high reliability level offered by these components have shown that estimating reliability through the traditional approaches is difficult, as historical failure data and/or past observed scenarios demonstrate. With the aim to propose new approaches for the evaluation of reliability, in this book, eleven innovative contributions are collected, all focused on the reliability assessment of power electronic devices and related components.
Power devices are key to modern power systems, performing functions such as inverting and changing voltages, buffering and switching. Following a device-centric approach, this book covers power electronic applications, semiconductor physics, materials science, application engineering, and key technologies such as MOSFET, IGBT and WBG.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
The field of power electronics is integral to modern technological advancement, covering diverse applications ranging from energy conversion to electronic control systems. “Power Electronics (Circuits, Devices and Application)” provides a comprehensive overview of this dynamic discipline, beginning with a comprehensive introduction to power electronics. This introductory chapter lays the groundwork by exploring the importance and wide-ranging applications of power electronics in contemporary technology, tracking its evolution, and highlighting emerging trends and future challenges. This book goes deep into the heart of power electronics with detailed discussions on power semiconductor devices, including diodes, rectifiers, MOSFETs, IGBTs, and the latest innovations in semiconductor technology. Subsequent chapters explore the design and operation of fundamental power electronic circuits such as AC-DC converters, DC-DC converters, and inverters, as well as advanced topics such as resonant converters and soft-switching techniques. Control techniques are critical to effective power electronics, and the book covers essential methods such as pulse width modulation, current and voltage control, and digital control techniques. The book also addresses critical aspects of power supplies and converters, including switched-mode power supplies, uninterruptible power supplies, and power factor correction techniques. The application chapters explore the role of power electronics in renewable energy systems, electric vehicles, industrial motor drives, and power quality improvement. Thermal management and reliability are discussed in detail, providing insights into heat transfer, cooling strategies, and reliability improvement techniques. Advanced topics include wide-bandgap semiconductor devices, power electronic integration, and emerging trends in research. The book also includes an in-depth exploration of design and simulation tools, with an emphasis on CAD tools, simulation software, and practical design examples. Concluding with a visionary perspective, the book examines future prospects, innovations in smart grid technologies, and the role of power electronics in IoT and smart cities, addressing the challenges and opportunities that lie ahead. This comprehensive resource is designed to equip readers with a deep understanding of power electronics and prepare them for future advancements in the field.
In modern industries, electrical energy conversion systems consist of two main parts: electrical machines and power electronic converters. With global electricity use at an all-time high, uninterrupted operation of electrical power converters is essential. Reliability in Power Electronics and Electrical Machines: Industrial Applications and Performance Models provides an in-depth analysis of reliability in electrical energy converters as well as strategies for designing dependable power electronic converters and electrical machines. Featuring a comprehensive discussion on the topics of reliability design and measurement, failure mechanisms, and specific issues pertaining to quality, efficiency, and durability, this timely reference source offers practical examples and research-based results for use by engineers, researchers, and advanced-level students.
The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.
This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.