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This pioneering text explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. It takes a new approach, carefully modelling circuit and interconnect faults, and applying graph techniques to solve problems.
The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.
Boundary-Scan, formally known as IEEE/ANSI Standard 1149.1-1990, is a collection of design rules applied principally at the Integrated Circuit (IC) level that allow software to alleviate the growing cost of designing, producing and testing digital systems. A fundamental benefit of the standard is its ability to transform extremely difficult printed circuit board testing problems that could only be attacked with Ad-Hoc testing methods into well-structured problems that software can easily and swiftly solve. IEEE testing standards of the 1149 family are living entities that grow and change quickly. The Boundary-Scan Handbook, Third Edition is intended to describe these standards in simple English, rather than the strict and pedantic legalese encountered in the standards. Over 180 drawings and 40 tables illustrate important concepts. Forty-six Design-for-Test rules are provided, with complete explanations. The fundamental 1149.1 standard is now over 13 years old and has a large infrastructure of support in the electronics industry. Today, a majority of custom ICs and Programmable Logic Devices have 1149.1 implementations. The Boundary-Scan Handbook, Third Edition updates the information about 1149.1, which has been revised as recently as 2001. It contains a description of the 1149.4 "Analog Boundary-Scan" standard, and gives a tutorial on analog testing technology. It then introduces the recently released IEEE 1149.6 "Advanced I/O" standard, which extends Boundary-Scan to deal with AC-coupled differential signaling now becoming common in higher performance system. Finally, since a board test system provides a suitable environment for programming non-volatile Programmable Logic Devices, the IEEE 1532 standard is described which extends the 1149.1 access protocol into the device programming domain. This forms an essential tool for testing boards and systems of the future.
Design for AT-Speed Test, Diagnosis and Measurement is the first book to offer practical and proven design-for-testability (DFT) solutions to chip and system design engineers, test engineers and product managers at the silicon level as well as at the board and systems levels. Designers will see how the implementation of embedded test enables simplification of silicon debug and system bring-up. Test engineers will determine how embedded test provides a superior level of at-speed test, diagnosis and measurement without exceeding the capabilities of their equipment. Product managers will learn how the time, resources and costs associated with test development, manufacture cost and lifecycle maintenance of their products can be significantly reduced by designing embedded test in the product. A complete design flow and analysis of the impact of embedded test on a design makes this book a `must read' before any DFT is attempted.
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Written in a clear and thoughtful style, Building a Successful Board-Test Strategy, Second Edition offers an integrated approach to the complicated process of developing the test strategies most suited to a company's profile and philosophy. This book also provides comprehensive coverage of the specifics of electronic test equipment as well as those broader issues of management and marketing that shape a manufacturer's "image of quality."In this new edition, the author adds still more "war stories," relevant examples from his own experience, which will guide his readers in their decisionmaking. He has also updated all technical aspects of the first edition, covering new device and attachment technologies, new inspection techniques including optical, infrared and x-ray, as well as vectorless methods for detecting surface-mount open-circuit board failures. The chapter on economics has been extensively revised, and the bibliography includes the latest material on this topic.*Discusses ball-grid arrays and other new devices and attachment technologies*Adds a comprehensive new chapter on optical, infrared, and x-ray inspection*Covers vectorless techniques for detecting surface-mount open-circuit board failures
The Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key information, design techniques and rules of thumb. Guaranteed not to gather dust on a shelf!Field Application engineers need to master a wide area of topics to excel. The Test and Measurement Know It All covers every angle including Machine Vision and Inspection, Communications Testing, Compliance Testing, along with Automotive, Aerospace, and Defense testing. - A 360-degree view from our best-selling authors - Topics include the Technology of Test and Measurement, Measurement System Types, and Instrumentation for Test and Measurement - The ultimate hard-working desk reference; all the essential information, techniques and tricks of the trade in one volume
Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. - Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. - Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. - Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. - Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. - Practical problems at the end of each chapter for students.
This book is the second of two volumes addressing the design challenges associated with new generations of semiconductor technology. The various chapters are compiled from tutorials presented at workshops in recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip.