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Beam Processing Technologies is a collection of papers that deals with the miniaturization of devices that will be faster, consume less power, and cost less per operation or fabrication. One paper discusses metal oxide semiconductor (MOS) integrated circuit technology including the operation of devices whose lateral and vertical dimensions are scaled down. If the devices' silicon doping profiles are increased by the same scale factor, they can operate on lower voltages and currents, with the same performance. Another paper describes laser beam processing and wafer-scale integration as techniques to increase the number of devices on a silicon chip. Electron beam technologies can be used in many fabrication processes such as in microlithography, selective oxidation, doping, metrology. Ion beam applications depend on the presence of the ion introduced into the device (e.g. implantation doping), on pseudoelastic collisions (e.g. physical sputtering or crystal damage), and on inelastic scattering (e.g. polymer resist exposure). Silicon molecular beam epitaxy (SiMBE) can also grow high-quality layers at low temperature, particularly concerning germanium, especially as reagrds the growth system design and utilization of n- and p-type doping. Chemical beam epitaxy (CBE) is another epitaxial growth technique that can surpass MBE and metal organic chemical vapor deposition (MO-CVD). The collection is suitable chemical engineers, industrial physicists, and researchers whose work involve micro-fabrication and development of integrated circuits.
Beam technologies play an important role in microelectronic component fabrication and offer opportunities for application in other manufacturing schemes. Emerging beam technologies that incorporate potential for sensors, control, and information processing have created new opportunities for integrated processing of materials and components. This volume identifies various beam technologies and their applications in electronics and other potential manufacturing processes. Recommendations for research and development to enhance the understanding, capabilities, and applications of beam technologies are presented.
Food safety is a constant challenge for the food industry, and food irradiation technology has developed significantly since its introduction, moving from isotope irradiation to the use of electron beam technology. Electron Beam Pasteurization and Complementary Food Processing Technologies explores the application of electron beam pasteurization in conjunction with other food processing technologies to improve the safety and quality of food. Part one provides an overview of the issues surrounding electron beam pasteurization in food processing. Part two looks at different thermal and non-thermal food processing technologies that complement irradiation. Finally, a case study section on the commercial applications of e-beam processing provides examples from industry.
This book, by 36 authorities on the subject, deals with ion beam processing for basic sputter etching of samples, for sputter deposition of thin films, for synthesis of material in thin film form, and of the modification of thin film properties.
Containing the proceedings of three symposia in the E-MRS series this book is divided into two parts. Part one is concerned with ion beam processing, a particularly powerful and versatile technology which can be used both to synthesise and modify materials, including metals, semiconductors, ceramics and dielectrics, with great precision and excellent control. Furthermore it also deals with the correlated effects in atomic and cluster ion bombardment and implantation. Part two deals with the deposition techniques, characterization and applications of advanced ceramic, metallic and polymeric coatings or thin films for surface protection against corrosion, erosion, abrasion, diffusion and for lubrication of contracting surfaces in relative motion.
Ion Implantation and Beam Processing covers the scientific and technological advances in the fields of ion implantation and beam processing. The book discusses the amorphization and crystallization of semiconductors; the application of the Boltzmann transport equation to ion implantation in semiconductors and multilayer targets; and the high energy density collision cascades and spike effects. The text also describes the implantation of insulators (ices and lithographic materials); the ion-bombardment-induced compositions changes in alloys and compounds; and the fundamentals and applications of ion beam and laser mixing. The high-dose implantation and the trends of ion implantation in silicon technology are also considered. The book further tackles the implantation in gaAs technology and the contacts and interconnections on semiconductors. Engineers and people involved in microelectronics will find the book invaluable.
The scientific and commercial purposes of ion beams are remarkable in many fields because ion beam technology is a primary tool that provides a wide range of applications in science, medicine, space, and engineering. This book presents theoretical and experimental knowledge about ion beam applications and technology. It includes six chapters that address such topics as the interaction of ion beams with matter, the evaluation of nuclear material damage, surface microstructure changes, oblique Ar+ sputtered SiC thin films, electron beam processing, and ribbon ion beams.