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An Introduction to Logic Circuit Testing provides a detailed coverage of techniques for test generation and testable design of digital electronic circuits/systems. The material covered in the book should be sufficient for a course, or part of a course, in digital circuit testing for senior-level undergraduate and first-year graduate students in Electrical Engineering and Computer Science. The book will also be a valuable resource for engineers working in the industry. This book has four chapters. Chapter 1 deals with various types of faults that may occur in very large scale integration (VLSI)-based digital circuits. Chapter 2 introduces the major concepts of all test generation techniques such as redundancy, fault coverage, sensitization, and backtracking. Chapter 3 introduces the key concepts of testability, followed by some ad hoc design-for-testability rules that can be used to enhance testability of combinational circuits. Chapter 4 deals with test generation and response evaluation techniques used in BIST (built-in self-test) schemes for VLSI chips. Table of Contents: Introduction / Fault Detection in Logic Circuits / Design for Testability / Built-in Self-Test / References
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
New, updated and expanded topics in the fourth edition include: EBCDIC, Grey code, practical applications of flip-flops, linear and shaft encoders, memory elements and FPGAs. The section on fault-finding has been expanded. A new chapter is dedicated to the interface between digital components and analog voltages. - A highly accessible, comprehensive and fully up to date digital systems text - A well known and respected text now revamped for current courses - Part of the Newnes suite of texts for HND/1st year modules
Offering first-hand insights by top scientists and industry experts at the forefront of R&D into nanoelectronics, this book neatly links the underlying technological principles with present and future applications. A brief introduction is followed by an overview of present and emerging logic devices, memories and power technologies. Specific chapters are dedicated to the enabling factors, such as new materials, characterization techniques, smart manufacturing and advanced circuit design. The second part of the book provides detailed coverage of the current state and showcases real future applications in a wide range of fields: safety, transport, medicine, environment, manufacturing, and social life, including an analysis of emerging trends in the internet of things and cyber-physical systems. A survey of main economic factors and trends concludes the book. Highlighting the importance of nanoelectronics in the core fields of communication and information technology, this is essential reading for materials scientists, electronics and electrical engineers, as well as those working in the semiconductor and sensor industries.