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Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Introductory technical guidance for electrical engineers and other professional engineers and construction managers interested in electromagnetic pulse protection for electronic equipment in buildings. Here is what is discussed: 1. INTRODUCTION. 2. EMP GENERATION, 3. HEMP INTERACTION WITH SYSTEMS, 4. PROTECTION AGAINST HEMP.
Introductory technical guidance for electrical engineers interested in design of electronic equipment facilities. Here is what is discussed: 1. INTRODUCTION, 2. COUPLING MECHANISMS, 3. COMMON-MODE NOISE, 4. MINIMIZATION TECHNIQUES, 5. FACILITY AND EQUIPMENT REQUIREMENTS.
Introduction to Adhesive Bonding A step-by-step introduction to basic principles and practical applications of adhesive bonding, designed for students and professionals alike Adhesive bonding—the process of joining two surfaces using glues, epoxies, plastic agents, and other adhesives—is a major technique with wide applications in industries as a diverse as aerospace, footwear manufacturing, and food packaging. Adhesive bonding holds several advantages over conventional joining techniques, such as uniform stress concentrations, protection of the bonded surfaces or joints, and the ability to join a variety of different materials and irregular surfaces. Introduction to Adhesive Bonding provides an accessible overview of the principles and common applications of adhesive bonding. Using a systematic approach, the authors thoroughly explain each step necessary to achieve a successful adhesive bond, including surface preparation, bonding agent selection, design and construction of bonded joints, health and safety considerations, and quality control. Readers are provided with both the theoretical foundation and practical information required to plan and complete their own adhesive bonding projects. This comprehensive yet reader-friendly volume: Highlights the inherent advantages of adhesive bonding in various applications Describes the use of adhesive bonding in the development of novel and advanced projects in different industries Features numerous real-world examples of adhesive bonding in areas such as the transportation industry, civil engineering, medical applications, and sports equipment Discusses how adhesives enable development of new products and constructions of reduced weight and size Identifies important limitations and durability concerns of the use of adhesives in specific applications Introduction to Adhesive Bonding is an ideal textbook for undergraduate or graduate Engineering and Chemistry programs, and a useful reference for researchers and industry professionals working in fields such as Engineering, Surface and Polymer Chemistry, and Materials Science.
Introductory technical guidance for electrical engineers and construction managers interested in bonding in buildings housing electronic equipment such as computer rooms, data processing facilities and communications equipment. Here is what is discussed:1. DEFINITION OF BONDING2. PURPOSES OF BONDING3. RESISTANCE CRITERIA4. DIRECT BONDS5. INDIRECT BONDS6. SURFACE PREPARATION7. COMPLETION OF THE BOND8. BOND CORROSION9. WORKMANSHIP10. SUMMARY OF GUIDELINES.
General Chemistry for Engineers explores the key areas of chemistry needed for engineers. This book develops material from the basics to more advanced areas in a systematic fashion. As the material is presented, case studies relevant to engineering are included that demonstrate the strong link between chemistry and the various areas of engineering. - Serves as a unique chemistry reference source for professional engineers - Provides the chemistry principles required by various engineering disciplines - Begins with an 'atoms first' approach, building from the simple to the more complex chemical concepts - Includes engineering case studies connecting chemical principles to solving actual engineering problems - Links chemistry to contemporary issues related to the interface between chemistry and engineering practices
Written to serve the needs of construction industry professionals, this practical handbook provides a consolidated guide for design engineers and project managers, as well as maintenance professionals, technicians and others who must accurately specify electrical equipment.
Introductory technical guidance for electrical engineers and construction managers interested in exterior electrical distribution. Here is what is discussed: 1. INTRODUCTION, 2. ELECTRICAL POWER REQUIREMENTS, 3. DESIGN CRITERIA, 4. DIRECTIONAL BORING, 5. BEST PRACTICES – GENERAL ELECTRICAL POWER REQUIREMENTS.
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.