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Miedema's plot is used to select the Cu/metal barrier for Cu metallization. The Cu/metal barrier system selected should have positive heat of formation (Hf) so that there is no intermixing between the two layers. In this case, Ru is chosen as a potential candidate, and then the barrier properties of sputtered Cu/Ru thin films on thermally grown SiO2 substrates are investigated by Rutherford backscattering spectrometry (RBS), X-ray diffractometry (XRD), and electrical resistivity measurement. The Cu/Ru/SiO2 samples are analyzed prior to and after vacuum annealing at various temperatures of 400, 500, and 600 oC and at different interval of times of 0.5, 1 and 2 hrs for each temperature. Backscattering analysis indicate that both the copper and ruthenium thin films are thermally stable at high temperature of 600 oC, without any interdiffusion and chemical reaction between Cu and Ru thin films. No new phase formation is observed in any of the Cu/Ru/SiO2 samples. The XRD data indicate no new phase formation in any of the annealed Cu/Ru/SiO2 samples and confirmed excellent thermal stability of Cu on Ru layer. The electrical resistivity measurement indicated that the electrical resistivity value of the copper thin films annealed at 400, 500, and 600 oC is essentially constant and the copper films are thermally stable on Ru, no reaction occurs between copper films and Ru the layer. Cu/Ru/SiO2 multilayered thin film samples have been shown to possess good mechanical strength and adhesion between the Cu and Ru layers compared to the Cu/SiO2 thin film samples. The strength evaluation is carried out under static loading conditions such as nanoindentation testing. In this study, evaluation and comparison is donebased on the dynamic deformation behavior of Cu/Ru/SiO2 and Cu/SiO2 samples under scratch loading condition as a measure of tribological properties. Finally, the deformation behavior under static and dynamic loading conditions is understood using the scanning electron microscope (SEM) and the focused ionbeam imaging microscope (FIB) for topographical and cross-sectional imaging respectively.
In this book, a team of outstanding scientists in the field of modern magnetic nanotechnologies illustrates the state-of-the-art in several areas of advanced magneto-electronic devices, magnetic micro-electromechanical systems and high density information storage technologies. Providing a unique source of information for the young physicist, chemist or engineer, the book also serves as a crucial reference for the expert scientist and the teacher of advanced university courses.
“Handbook of Thin Film Technology” covers all aspects of coatings preparation, characterization and applications. Different deposition techniques based on vacuum and plasma processes are presented. Methods of surface and thin film analysis including coating thickness, structural, optical, electrical, mechanical and magnetic properties of films are detailed described. The several applications of thin coatings and a special chapter focusing on nanoparticle-based films can be found in this handbook. A complete reference for students and professionals interested in the science and technology of thin films.
This two-volume set contains a collection of 381 peer-reviewed papers. Its aim is to bring together the latest advances in, and applications of, alloy design, process development, component engineering, phase-composition prediction, high-temperature oxidation, wrought alloys, lifetime estimation and materials behavior, cobalt-based alloys, nickel-iron alloys, joining, alternative materials and powder-metallurgy and also to consider the future of superalloys.
Themes reflect the work carried out within the framework of COST-501 and of COST-505 the latter being concerned with materials for steam turbines and the first results of the concerted action COST-501/II 'High temperature materials for power engineering' initiated in 1988.
Very light, very strong. extremely reliable -aircraft and aerospace engineers are. and have to be. very demanding partners in the materials community. The results of their research and development work is not only crucial for one special area of applications. but can also lead the way to new solutions in many other areas of advanced technology. Springer-Verlag and the undersigned editor are pleased to present in this volume. an overview of the many facets of materials science and technology which have been the objective of intensive and systematic research work during past decades in the laboratories of the German Aerospace Research Establishment. Its contents shows clearly the interrelations between goals defined by the user. fundamentals provided by the scientists and viable solutions developed by the practical engineer. The particular personal touch which has been given to this volume by its authors in dedicating it as a farewell present to Professor Wolfgang Bunk. inspiring sci entist and director of the DLR Intitute of Materials Research for more than 20 years. has obviously given an added value to this important publication. Surely. this truly cooperative endeavour will render a valuable service to a large interna tional community of interested readers. many of them having personal links to the Institute. its director and its staff.