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During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Open System LANs and Their Global Interconnection focuses on the OSI layer 1 to 4 standards (the OSI bearer service) and also introduces TCP/IP and some of the proprietary PC Local Area Network (LAN) standards. The publication first provides an introduction to Local Area Networks (LANs) and Wide Area Networks (WANs), Open Systems Interconnection (OSI), and LAN standards. Discussions focus on MAC bridging, token bus, slotted ring, MAC constraints and design considerations, OSI functional standards, OSI model, value of the transport model, benefits and origins of OSI, and significance of the transport. The manuscript then takes a look at Data Link Control Standards and Network Layer Control. Topics cover relaying, addressing, and routeing, use of the ISO 8473 Network Protocol in LANs, Connectionless-mode Network Protocol ISO 8473, connection-mode and connectionless-mode, High Level Data Link Control (HDLC), and data link control in WANs and LANs. The text examines structured building cabling, OSI management, functional standards and proprietary competitors, and transport control standards. Concerns include Connection-mode Transport Protocol, Network Connection Management Subprotocol (NCMS), OSI functional standards, management information model, LAN management, Simple Network Management Protocol (SNMP), and supporting LAN Standards. The publication is a vital reference for computer science experts and researchers interested in open system Local Area Networks.
Programmable Logic Devices (PLDs) have become the key implementation medium for the vast majority of digital circuits designed today. While the highest-volume devices are still built with full-fabrication rather than field programmability, the trend towards ever fewer ASICs and more FPGAs is clear. This makes the field of PLD architecture ever more important, as there is stronger demand for faster, smaller, cheaper and lower-power programmable logic. PLDs are 90% routing and 10% logic. This book focuses on that 90% that is the programmable routing: the manner in which the programmable wires are connected and the circuit design of the programmable switches themselves. Anyone seeking to understand the design of an FPGA needs to become lit erate in the complexities of programmable routing architecture. This book builds on the state-of-the-art of programmable interconnect by providing new methods of investigating and measuring interconnect structures, as well as new programmable switch basic circuits. The early portion of this book provides an excellent survey of interconnec tion structures and circuits as they exist today. Lemieux and Lewis then provide a new way to design sparse crossbars as they are used in PLDs, and show that the method works with an empirical validation. This is one of a few routing architecture works that employ analytical methods to deal with the routing archi tecture design. The analysis permits interesting insights not typically possible with the standard empirical approach.