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The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device elements, with a focus on CMOS, silicon on insulator (SOI), and Silicon Germanium (SiGe) technology; focuses on the ESD design, optimization, integration and synthesis of these elements and concepts into ESD networks, as well as applying within the off-chip driver networks, and on-chip receivers; and highlights state-of-the-art ESD input circuits, as well as ESD power clamps networks. Continuing the author’s series of books on ESD, this book will be an invaluable reference for the professional semiconductor chip and system ESD engineer. Semiconductor device and process development, quality, reliability and failure analysis engineers will also find it an essential tool. In addition, both senior undergraduate and graduate students in microelectronics and IC design will find its numerous examples useful.
Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.