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An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
This book, the eighth in a popular series from MRS, features the latest technical information on ferroelectric thin films from an international mix of academia, industry and government organizations. Recent results for DRAM and FERAM devices, as well as enhancements in material performance for these applications, are presented. Significant advances in understanding leakage current, frequency dependence of the coercive field, hydrogen annealing effects, piezoelectric constants, and domain switching responses are highlighted. The development of ferroelectric thin films for piezoelectric applications are also reviewed, as are improved film-fabrication procedures including chemical vapor deposition and chemical solution deposition. Topics include: BST thin films and DRAM; integration and electrodes; Bi-based thin-film ferroelectrics; Pb-based thin-film ferroelectrics; fundamental properties of thin-film ferroelectrics; ferroelectric gate materials and devices; and piezoelectric, pyro-electric and capacitor devices and novel processing strategies.
The advent of engineering-designed polymer matrix composites in the late 1940s has provided an impetus for the emergence of sophisticated ceramic matrix composites. The development of CMCs is a promising means of achieving lightweight, structural materials combining high temperature strength with improved fracture toughness, damage tolerance and thermal shock resistance. Considerable research effort is being expended in the optimisation of ceramic matrix composite systems, with particular emphasis being placed on the establishment of reliable and cost-effective fabrication procedures. Ceramic matrix composites consists of a collection of chapters reviewing and describing the latest advances, challenges and future trends in the microstructure and property relationship of five areas of CMCs. Part one focuses on fibre, whisker and particulate-reinforced ceramic matrix composites, part two explores graded and layered ceramics, while the five chapters in part three cover nanostructured CMCs in some detail. Refractory and speciality ceramic composites are looked at in part four, with chapters on magnesia-spinel composite refractory materials, thermal shock of CMCs and superplastic CMCs. Finally, part four is dedicated to non-oxide ceramic composites. Ceramic matrix composites is a comprehensive evaluation of all aspects of the interdependence of processing, microstructure, properties and performance of each of the five categories of CMC, with chapters from experienced and established researchers. It will be essential for researchers and engineers in the field of ceramics and more widely, in the field of inorganic materials. Looks at the latest advances, challenges and future trends Compiled by experienced and established researchers in the field Essential for researchers and engineers
Papers presented at the 1991 Fall Meeting of the Materials Research Society
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package. * Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume * written by renowned experts in the field * Provides an up-to-date starting point in this young research field.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.