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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
This book aims to recapitulate old information's available and brings new information's that are with the fashion research on an atomic and nanometric scale in various fields by introducing several mathematical models to measure some parameters characterizing metals like the hydrodynamic elasticity coefficient, hardness, lubricant viscosity, viscosity coefficient, tensile strength .... It uses new measurement techniques very developed and nondestructive. Its principal distinctions of the other books, that it brings practical manners to model and to optimize the cutting process using various parameters and different techniques, namely, using water of high-velocity stream, tool with different form and radius, the cutting temperature effect, that can be measured with sufficient accuracy not only at a research lab and also with a theoretical forecast. This book aspire to minimize and eliminate the losses resulting from surfaces friction and wear which leads to a greater machining efficiency and to a better execution, fewer breakdowns and a significant saving. A great part is devoted to lubrication, of which the goal is to find the famous techniques using solid and liquid lubricant films applied for giving super low friction coefficients and improving the lubricant properties on surfaces.
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
This thoroughly updated new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. It forms a bridge between fundamental theory and practical application, giving an insight into innovative new materials, devices and systems. Organized into three parts for ease of use, this Handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS. Wide varieties of functional thin film materials and processing are described, and experimental data is provided with detailed examples and theoretical descriptions. - A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available - All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique - 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere
Discover a novel, self-contained approach to an important technical area, providing both theoretical background and practical details. Coverage includes mechanics and physical metallurgy, as well as study of both established and novel procedures such as indentation plastometry. Numerical simulation (FEM modelling) is explored thoroughly, and issues of scale are discussed in depth. Discusses procedures designed to explore plasticity under various conditions, and relates sample responses to deformation mechanisms, including microstructural effects. Features references throughout to industrial processing and component usage conditions, to a wide range of metallic alloys, and to effects of residual stresses, anisotropy and inhomogeneity within samples. A perfect tool for materials scientists, engineers and researchers involved in mechanical testing (of metals), and those involved in the development of novel materials and components.
This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.