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The power and thermal management/balancing is of increasing concern and is a technological challenge to the multi-core processor (MCP) development and will be a main performance bottleneck for the development of MCPs. The work presented in this thesis discusses the thermal and power management of MCPs with both two dimensional (2D) package and three dimensional (3D) package chips. For 2D package chips, a group of one dimensional (1D) partial differential equations (PDEs), which is derived from the 3D PDE heat conduction equation, is proposed to describe the thermal behavior of each core. Thereafter, an optimal controller is designed to manage the power consumption and balance the temperature among the cores based on the proposed 1D model. Different from 2D package chips, a liquid cooling system should be installed among the layers to reduce the internal temperature of 3D chips. Due to the complexity of the system, the thermal behavior of the whole system is modeled as an ordinary differential equation (ODE) system. For balancing the temperature a two step control policy is proposed. In the first step the micro-channel liquid velocity is set based on a logical algorithm. Thus, the system is described as a switched linear system. In the second step the model predictive control method is employed to design the thermal and power management/balancing controller.
This book focuses on two of the most relevant problems related to power management on multicore and manycore systems. Specifically, one part of the book focuses on maximizing/optimizing computational performance under power or thermal constraints, while another part focuses on minimizing energy consumption under performance (or real-time) constraints.
This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
This handbook offers a comprehensive review of the state-of-the-art research achievements in the field of data centers. Contributions from international, leading researchers and scholars offer topics in cloud computing, virtualization in data centers, energy efficient data centers, and next generation data center architecture. It also comprises current research trends in emerging areas, such as data security, data protection management, and network resource management in data centers. Specific attention is devoted to industry needs associated with the challenges faced by data centers, such as various power, cooling, floor space, and associated environmental health and safety issues, while still working to support growth without disrupting quality of service. The contributions cut across various IT data technology domains as a single source to discuss the interdependencies that need to be supported to enable a virtualized, next-generation, energy efficient, economical, and environmentally friendly data center. This book appeals to a broad spectrum of readers, including server, storage, networking, database, and applications analysts, administrators, and architects. It is intended for those seeking to gain a stronger grasp on data center networks: the fundamental protocol used by the applications and the network, the typical network technologies, and their design aspects. The Handbook of Data Centers is a leading reference on design and implementation for planning, implementing, and operating data center networks.
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
In continuation of a successful series of events, the 4th Many-core Applications Research Community (MARC) symposium took place at the HPI in Potsdam on December 8th and 9th 2011. Over 60 researchers from different fields presented their work on many-core hardware architectures, their programming models, and the resulting research questions for the upcoming generation of heterogeneous parallel systems.
This book presents the state-of-the art of one of the main concerns with microprocessors today, a phenomenon known as "dark silicon". Readers will learn how power constraints (both leakage and dynamic power) limit the extent to which large portions of a chip can be powered up at a given time, i.e. how much actual performance and functionality the microprocessor can provide. The authors describe their research toward the future of microprocessor development in the dark silicon era, covering a variety of important aspects of dark silicon-aware architectures including design, management, reliability, and test. Readers will benefit from specific recommendations for mitigating the dark silicon phenomenon, including energy-efficient, dedicated solutions and technologies to maximize the utilization and reliability of microprocessors.
"The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transisto"
Power consumption becomes the most important design goal in a wide range of electronic systems. There are two driving forces towards this trend: continuing device scaling and ever increasing demand of higher computing power. First, device scaling continues to satisfy Moore’s law via a conventional way of scaling (More Moore) and a new way of exploiting the vertical integration (More than Moore). Second, mobile and IT convergence requires more computing power on the silicon chip than ever. Cell phones are now evolving towards mobile PC. PCs and data centers are becoming commodities in house and a must in industry. Both supply enabled by device scaling and demand triggered by the convergence trend realize more computation on chip (via multi-core, integration of diverse functionalities on mobile SoCs, etc.) and finally more power consumption incurring power-related issues and constraints. Energy-Aware System Design: Algorithms and Architectures provides state-of-the-art ideas for low power design methods from circuit, architecture to software level and offers design case studies in three fast growing areas of mobile storage, biomedical and security. Important topics and features: - Describes very recent advanced issues and methods for energy-aware design at each design level from circuit and architecture to algorithm level, and also covering important blocks including low power main memory subsystem and on-chip network at architecture level - Explains efficient power conversion and delivery which is becoming important as heterogeneous power sources are adopted for digital and non-digital parts - Investigates 3D die stacking emphasizing temperature awareness for better perspective on energy efficiency - Presents three practical energy-aware design case studies; novel storage device (e.g., solid state disk), biomedical electronics (e.g., cochlear and retina implants), and wireless surveillance camera systems. Researchers and engineers in the field of hardware and software design will find this book an excellent starting point to catch up with the state-of-the-art ideas of low power design.