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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Food Packaging: Innovations and Shelf-life covers recently investigated developments in food packaging and their influence in food quality preservation, shelf-life extension, and simulation techniques. Additionally, the book discusses the environmental impact and sustainable solutions of food packaging. This book is divided into seven chapters, written by worldwide experts. The book is an ideal reference source for university students, food engineers and researchers from R&D laboratories working in the area of food science and technology. Professionals from institutions related to food packaging.
This issue of ECS Transactions focuses on issues pertinent to materials growth, characterization, processing, development, application of compound semiconductor materials and devices, including nitrides and wide-bandgap semiconductors.
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
The design and manufacture of reliable products is a major challenge for engineers and managers. This book arms technical managers and engineers with the tools to compete effectively through the design and production of reliable technology products.
The authoritative guide to the effective design and production of reliable technology products, revised and updated While most manufacturers have mastered the process of producing quality products, product reliability, software quality and software security has lagged behind. The revised second edition of Improving Product Reliability and Software Quality offers a comprehensive and detailed guide to implementing a hardware reliability and software quality process for technology products. The authors – noted experts in the field – provide useful tools, forms and spreadsheets for executing an effective product reliability and software quality development process and explore proven software quality and product reliability concepts. The authors discuss why so many companies fail after attempting to implement or improve their product reliability and software quality program. They outline the critical steps for implementing a successful program. Success hinges on establishing a reliability lab, hiring the right people and implementing a reliability and software quality process that does the right things well and works well together. Designed to be accessible, the book contains a decision matrix for small, medium and large companies. Throughout the book, the authors describe the hardware reliability and software quality process as well as the tools and techniques needed for putting it in place. The concepts, ideas and material presented are appropriate for any organization. This updated second edition: Contains new chapters on Software tools, Software quality process and software security. Expands the FMEA section to include software fault trees and software FMEAs. Includes two new reliability tools to accelerate design maturity and reduce the risk of premature wearout. Contains new material on preventative maintenance, predictive maintenance and Prognostics and Health Management (PHM) to better manage repair cost and unscheduled downtime. Presents updated information on reliability modeling and hiring reliability and software engineers. Includes a comprehensive review of the reliability process from a multi-disciplinary viewpoint including new material on uprating and counterfeit components. Discusses aspects of competition, key quality and reliability concepts and presents the tools for implementation. Written for engineers, managers and consultants lacking a background in product reliability and software quality theory and statistics, the updated second edition of Improving Product Reliability and Software Quality explores all phases of the product life cycle.