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Device testing represents the single largest manufacturing expense in the semiconductor industry, costing over $40 billion a year. The most comprehensive and wide ranging book of its kind, Testing of Digital Systems covers everything you need to know about this vitally important subject. Starting right from the basics, the authors take the reader through automatic test pattern generation, design for testability and built-in self-test of digital circuits before moving on to more advanced topics such as IDDQ testing, functional testing, delay fault testing, memory testing, and fault diagnosis. The book includes detailed treatment of the latest techniques including test generation for various fault models, discussion of testing techniques at different levels of integrated circuit hierarchy and a chapter on system-on-a-chip test synthesis. Written for students and engineers, it is both an excellent senior/graduate level textbook and a valuable reference.
Large system complexities and operation under tight timing constraints in rapidly shrinking technologies have made it extremely important to ensure correct temporal behavior of modern-day digital circuits, both before and after fabrication. Research in (pre-fabrication) timing verification and (post-fabrication) delay fault testing has evolved along largely disjoint lines in spite of the fact that they share many basic concepts. A Unified Approach for Timing Verification and Delay Fault Testing applies concepts developed in the context of delay fault testing to path sensitization, which allows an accurate timing analysis mechanism to be developed. This path sensitization strategy is further applied for efficient delay fault diagnosis and delay fault coverage estimation. A new path sensitization strategy called Signal Stabilization Time Analysis (SSTA) has been developed based on the fact that primitive PDFs determine the stabilization time of the circuit outputs. This analysis has been used to develop a feasible method of identifying the primitive PDFs in a general multi-level logic circuit. An approach to determine the maximum circuit delay using this primitive PDF identification mechanism is also presented. The Primitive PDF Identification-based Timing Analysis (PITA) approach is proved to determine the maximum floating mode circuit delay exactly under any component delay model, and provides several advantages over previously floating mode timing analyzers. A framework for the diagnosis of circuit failures caused by distributed path delay faults is also presented. A metric to quantify the diagnosability of a path delay fault for a test is also proposed. Finally, the book presents a very realistic metric for delay fault coverage which accounts for delay fault size distributions and is applicable to any delay fault model. A Unified Approach for Timing Verification and Delay Fault Testing will be of interest to university and industry researchers in timing analysis and delay fault testing as well as EDA tool development engineers and design verification engineers dealing with timing issues in ULSI circuits. The book should also be of interest to digital designers and others interested in knowing the state of the art in timing verification and delay fault testing.
The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.
Defect oriented testing is expected to play a significant role in coming generations of technology. Smaller feature sizes and larger die sizes will make ICs more sensitive to defects that can not be modeled by traditional fault modeling approaches. Furthermore, with increased level of integration, an IC may contain diverse building blocks. Such blocks include, digital logic, PLAs, volatile and non-volatile memories, and analog interfaces. For such diverse building blocks, traditional fault modeling and test approaches will become increasingly inadequate. Defect oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits (ICs) have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of highest possible quality. Testing, in general and, defect oriented testing, in particular, help in realizing these objectives. Defect Oriented Testing for CMOS Analog and Digital Circuits is the first book to provide a complete overview of the subject. It is essential reading for all design and test professionals as well as researchers and students working in the field. `A strength of this book is its breadth. Types of designs considered include analog and digital circuits, programmable logic arrays, and memories. Having a fault model does not automatically provide a test. Sometimes, design for testability hardware is necessary. Many design for testability ideas, supported by experimental evidence, are included.' ... from the Foreword by Vishwani D. Agrawal
"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
The theme of the April 1999 symposium Scaling deeper to submicron: test technology challenges reflects the issues being created by the move toward nanometer technologies. Many creative and novel ideas and approaches to the current and future electronic circuit testing-related problems are explored
ITC is the World's largest premier technical conference on the testing and total quality of integrated electronics and the assenblies and systems that are based on them.