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Abstract: "Two approaches have been used to balance the cost of generating effective tests for ICs and the need to increase the IC's quality level. The first approach favors using high-level fault models to reduce test generation costs at the expense of test quality, and the second approach favors the use of low-level, technology-specific fault models to increase defect coverage but lead to unacceptably high test generation costs. In this report we (1) present the results of simulations of complete single stuck-at test sets against a low-level model of bridge defects showing that an unacceptably high percentage of such defects are not detected by the complete stuck-at test sets; (2) show how low-level bridge fault models can be incorporated into high-level test generation; and (3) describe our system for generating effective tests for bridge faults and report on its performance."
A pragmatic approach to testing electronic systems As we move ahead in the electronic age, rapid changes in technology pose an ever-increasing number of challenges in testing electronic products. Many practicing engineers are involved in this arena, but few have a chance to study the field in a systematic way-learning takes place on the job. By covering the fundamental disciplines in detail, Principles of Testing Electronic Systems provides design engineers with the much-needed knowledge base. Divided into five major parts, this highly useful reference relates design and tests to the development of reliable electronic products; shows the main vehicles for design verification; examines designs that facilitate testing; and investigates how testing is applied to random logic, memories, FPGAs, and microprocessors. Finally, the last part offers coverage of advanced test solutions for today's very deep submicron designs. The authors take a phenomenological approach to the subject matter while providing readers with plenty of opportunities to explore the foundation in detail. Special features include: * An explanation of where a test belongs in the design flow * Detailed discussion of scan-path and ordering of scan-chains * BIST solutions for embedded logic and memory blocks * Test methodologies for FPGAs * A chapter on testing system on a chip * Numerous references
Testing techniques for VLSI circuits are undergoing many exciting changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last fifteen years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers. Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than fifteen years of research in this area.
A recent technological advance is the art of designing circuits to test themselves, referred to as a Built-In Self-Test. This book is written from a designer's perspective and describes the major BIST approaches that have been proposed and implemented, along with their advantages and limitations.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
This book discusses in detail the correlation between physical defects and logic faults, and shows you how Iddq testing locates these defects. The book provides planning guidelines and optimization methods and is illustrated with numerous examples ranging from simple circuits to extensive case studies.