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With the reduction in transistor dimensions to a few tens of nanometers as a result of aggressive scaling, interconnect delay has now become one of the major bottlenecks to chip performance. Secondly, interconnect power and area have both become a significant part of the total chip power and area respectively. These concerns have led to an effort to find a solution that would reduce interconnect delay and leakage, while also reducing the area they occupy in a chip, so that either the chip area could be reduced, or more functionality could be incorporated within a certain area. 3D integration, i.e., stacking of various sub-systems of a chip on top of each other, enables chip-makers to achieve higher packaging efficiencies, thereby reducing system cost, while also reducing delay (and thus increasing the available bandwidth). Through Silicon Vias (TSVs) have emerged as the key interconnect technology for 3D ICs, as they enable significant reduction in delay and leakage compared to wire-bonded dies, while also occupying less area in a package. They also enable stacking of sub-systems which differ in functionality, and stacking of multiple dies. Also, unlike wire-bond, dies need not be bandwidth limited by the number of wire bonds that can be made between two levels in a stack. While TSVs offer many advantages, one of the concerns when implementing a 3D system using TSVs is the mechanisms of interaction between a TSV and a device in its vicinity. Another concern is with regards to the interaction between the TSV and its surrounding material. The purpose of this thesis is to develop a TCAD framework for process and device co-simulation of a TSV transistor system to study the various mechanisms of interaction between them, as well as between the TSV and substrate. The utility of this tool has been demonstrated by studying two mechanisms of interaction, the effect of TSV-induced stress, and the effect of TSV-device electrical coupling, on the electrical performance of bulk NMOS and PMOS transistors. The results from 3D TCAD simulations suggest that designers can scale the keep out zone (KOZ) around TSVs more aggressively, allowing for more efficient utilization of silicon area, without a drastic performance penalty.
Technology computer-aided design, or TCAD, is critical to today’s semiconductor technology and anybody working in this industry needs to know something about TCAD. This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D. It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations. Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.
Optoelectronics has become an important part of our lives. Wherever light is used to transmit information, tiny semiconductor devices are needed to transfer electrical current into optical signals and vice versa. Examples include light emitting diodes in radios and other appliances, photodetectors in elevator doors and digital cameras, and laser diodes that transmit phone calls through glass fibers. Such optoelectronic devices take advantage of sophisticated interactions between electrons and light. Nanometer scale semiconductor structures are often at the heart of modern optoelectronic devices. Their shrinking size and increasing complexity make computer simulation an important tool to design better devices that meet ever rising perfomance requirements. The current need to apply advanced design software in optoelectronics follows the trend observed in the 1980's with simulation software for silicon devices. Today, software for technology computer-aided design (TCAD) and electronic design automation (EDA) represents a fundamental part of the silicon industry. In optoelectronics, advanced commercial device software has emerged recently and it is expected to play an increasingly important role in the near future. This book will enable students, device engineers, and researchers to more effectively use advanced design software in optoelectronics. Provides fundamental knowledge in semiconductor physics and in electromagnetics, while helping to understand and use advanced device simulation software Demonstrates the combination of measurements and simulations in order to obtain realistic results and provides data on all required material parameters Gives deep insight into the physics of state-of-the-art devices and helps to design and analyze of modern optoelectronic devices
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
As computation continues to move into the cloud, the computing platform of interest no longer resembles a pizza box or a refrigerator, but a warehouse full of computers. These new large datacenters are quite different from traditional hosting facilities of earlier times and cannot be viewed simply as a collection of co-located servers. Large portions of the hardware and software resources in these facilities must work in concert to efficiently deliver good levels of Internet service performance, something that can only be achieved by a holistic approach to their design and deployment. In other words, we must treat the datacenter itself as one massive warehouse-scale computer (WSC). We describe the architecture of WSCs, the main factors influencing their design, operation, and cost structure, and the characteristics of their software base. We hope it will be useful to architects and programmers of today's WSCs, as well as those of future many-core platforms which may one day implement the equivalent of today's WSCs on a single board. Table of Contents: Introduction / Workloads and Software Infrastructure / Hardware Building Blocks / Datacenter Basics / Energy and Power Efficiency / Modeling Costs / Dealing with Failures and Repairs / Closing Remarks
This hands-on introduction to silicon photonics engineering equips students with everything they need to begin creating foundry-ready designs.
This book presents the latest techniques for machine learning based data analytics on IoT edge devices. A comprehensive literature review on neural network compression and machine learning accelerator is presented from both algorithm level optimization and hardware architecture optimization. Coverage focuses on shallow and deep neural network with real applications on smart buildings. The authors also discuss hardware architecture design with coverage focusing on both CMOS based computing systems and the new emerging Resistive Random-Access Memory (RRAM) based systems. Detailed case studies such as indoor positioning, energy management and intrusion detection are also presented for smart buildings.