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he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.
he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.
he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.
This book is the second of two volumes addressing the design challenges associated with new generations of semiconductor technology. The various chapters are compiled from tutorials presented at workshops in recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip.
The field of application-specific integrated circuits (ASICs) is fast-paced being at the very forefront of modern nanoscale fabrication and presents a deeply engaging career path. ASICs can provide us with high-speed computation in the case of digital circuits. For example, central processing units, graphics processing units, field-programmable gate arrays, and custom-made digital signal processors are examples of ASICs and the transistors they are fabricated from. We can use that same technology complementary metal-oxide semiconductor processes to implement high-precision sensing of or interfacing to the world through analog-to-digital converters, digital-to-analog converters, custom image sensors, and highly integrated micron-scale sensors such as magnetometers, accelerometers, and microelectromechanical machines. ASIC technologies now transitioning toward magneto-resistive and phase-changing materials also offer digital memory capacities that have aided our technological progress. Combining these domains, we have moved toward big data analytics and the new era of artificial intelligence and machine learning. This book provides a small selection of chapters covering aspects of ASIC development and the surrounding business model.
Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs