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This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
This book highlights a high-density helicon plasma source produced by radio frequency excitation in the presence of magnetic fields, which has attracted considerable attention thanks to its wide applicability in various fields, from basic science to industrial use. Presenting specific applications such as plasma thrusters, nuclear fusion, and plasma processing, it offers a review of modern helicon plasma science for a broad readership. The book covers a wide range of topics, including the fundamental physics of helicon plasma and their cutting-edge applications, based on his abundant and broad experience from low to high temperature plasmas, using various linear magnetized machines and nuclear fusion ones such as tokamaks and reversed field pinches. It first provides a brief overview of the field and a crash course on the fundamentals of plasma, including miscellaneous diagnostics, for advanced undergraduate and early graduate students in plasma science, and presents the basics of helicon plasma for beginners in the field. Further, digesting advanced application topics is also useful for experts to have a quick overview of extensive helicon plasma science research.
This volume comprises select papers presented at the International Conference on Advances in Manufacturing Technology (ICAMT 2018). It includes contributions from different researchers and practitioners working in the field of advanced manufacturing technology. This book covers diverse topics of contemporary manufacturing technology including material processes, machine tools, cutting tools, robotics and automation, manufacturing systems, optimization technologies, 3D scanning and re-engineering, and 3D printing. Computer applications in design, analysis, and simulation tools for solving manufacturing problems at various levels starting from material designs to complex manufacturing systems are also discussed. This book will be useful for students, researchers, and practitioners working in the field of manufacturing technology.