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Tremendous advances have been made in the use of silicides as contacts and interconnects in micro-electronic devices and as active layers in sensors. A flourish of novel fabrication concepts and characterization techniques has led to high-quality silicide devices and a better understanding of the electronic and micrometallurgical properties of their interfaces. However, the shrinking physical dimensions of ULSI devices beyond the deep submicron regime now poses new and serious materials challenges for the development of manufacturable silicide processes. Scientists and engineers from materials science, physics, chemistry, device, processing and other disciplines come together in this book to examine the current issues facing silicide thin-film applications. Topics include: silicide fundamentals - energetics and kinetics; processing of silicide thin films; ULSI issues; CVD silicides; semiconducting silicides; processing of germano-silicide thin films; silicides and analogs for IR detection; interfaces, surfaces and epitaxy; novel structures and techniques and properties of silicide thin films.
Our understanding and control of epitaxial oxide heterostructures has progressed along multiple frontiers including magnetic, dielectric, ferroelectric, and superconducting oxide materials. This has resulted in both independent rediscovery and the successful borrowing of ideas from ceramic science, solid-state physics, and semiconductor epitaxy. A new field of materials science has emerged which aims at the use of the intrinsic properties of various oxide materials in single-crystal thin-film form. Exploiting the potential of these materials, however, will only be possible if many fundamental and engineering questions can be answered. This book represents continued progress toward fulfilling that promise. Technical information on epitaxial oxide thin films from industry, academia and government laboratories is presented. Topics include: dielectrics; ferroelectrics; optics; superconductors; magnetics; magnetoresistance.
This book focuses on the fractal aspects of materials and disordered systems. Disorder plays a critical role in many naturally occurring and manufactured materials, both at the microscopic level (e.g., glasses) and the macroscopic level (e.g., foams, dendritic alloys, porous rock). The book addresses the dynamical processes involved in the formation and characterization of a wide range of disordered materials. Topics include: porous media; colloids; chemical reactions; dynamical aspects of the liquid-glass transition; disordered materials and surfaces and scaling and nanostructures.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
While the effects of spontaneous ordering or composition modulation on the properties of semiconductors and optoelectronic devices have been studied with great interest over the past several years, an understanding of the physics and chemistry of these two related phenomena is still in its infancy. This book brings together researchers from around the world to address issues concerning the physics, chemistry and growth parameters for spontaneous ordering and composition modulation. Developments in the use of artificial patterning to obtain new structured materials on a microscopic scale are featured. Advances in characterization techniques are also presented. Topics include: spontaneous ordering; self-assembled structures and quantum dots; self-organized epitaxial structures; composition modulation studies and optoelectronic materials.
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
There has been considerable progress in the development of thin-film photovoltaic devices with new efficiency records and enhanced durability. These achievements are the result of significant advances in the fundamental understanding of the materials, interfaces and devices. With 18 countries represented, this truly international volume brings together engineers and researchers from academic, industrial and national laboratories worldwide to review different materials systems and address common issues and problems. A wide variety of topics related to the development of thin-film photovoltaic and related devices, including thick-film transistors and materials for flat-panel displays, are addressed. Areas of emphasis include materials synthesis, device fabrication and characterization, and modelling. Topics include: thin-film amorphous silicon devices; thin-film silicon devices; thin-film devices based on copper-indium diselenide; cadmium-telluride devices; transparent conductive oxides and related materials for thin-film devices; and novel concepts for thin-film photovoltaics.
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.