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Recognizing the need for improved control measures in the manufacturing process of highly sensitized semiconductor technology, this practical reference provides in-depth and advanced treatment on the origins, procedures, and disposal of a variety of contaminants. It uses contemporary examples based on the latest hardware and processing apparatus to illustrate previously unavailable results and insights along with experimental and theoretical developments. Ensures the proper methods necessary to meet the standards established in the 1997 National Technology Roadmap for Semiconductors (NTRS)! Summarizing up-to-date control practices in the industry, Contamination-Free Manufacturing for Semiconductors and Other Precision Products: Details the physics and chemistry behind the mechanisms leading to contamination-induced failures Considers particles and molecular contaminants, including the entire spectrum of mass-based contaminants Outlines primary contamination problems and target control levels Reveals and offers solutions to inadequate areas of measurement capability and control technology Clarifies significant problems and decisions facing the industry by analyzing NTRS standards and contamination mechanisms Containing over 700 literature references, drawings, photographs, equations, and tables, Contamination-Free Manufacturing for Semiconductors and Other Precision Products is an essential reference for electrical and electronics, instrumentation, process, manufacturing, development, contamination control and quality engineers; physicists; and upper-level undergraduate and graduate students in these disciplines.
The semiconductor market refers to the industry involved in the design, development, manufacturing, and distribution of semiconductors, which are the building blocks of electronic devices. Semiconductors are materials with electrical conductivity between that of conductors (such as metals) and insulators (such as plastics). They are primarily made of silicon, although other materials like gallium arsenide, germanium, and indium phosphide are also used. The semiconductor market has experienced significant growth over the years due to the increasing demand for electronic devices and advancements in technology. The market is driven by various factors such as the growing demand of smartphones and mobile devices, the expansion of the automotive industry, the rise of Internet of Things (IoT) devices, and the development of emerging technologies like artificial intelligence (AI), virtual reality (VR), and autonomous vehicles, etc. To sum up, the semiconductor market is a dynamic and rapidly evolving industry that plays a critical role in shaping the modern technological landscape. Its growth is driven by advancements in various sectors, and it continues to be a key enabler of innovation and technological progress. The range of individual technological elements necessary for the semiconductor industry is extensive, leading to the publication of numerous technical books across various domains. (while it is understandable that advanced technologies specific to each company are not publicly disclosed due to concerns regarding potential leaks) These publications have undeniably played a significant role in aiding professionals and students for establishing a solid foundation of knowledge. In addition to the importance of individual technologies, it is necessary to examine what final products emerge as these technologies converge. While consumer electronics such as PCs and smartphones vary, there are common aspects among the semiconductor products that constitute them. Should one seek more comprehensive materials, it often entails a costly purchase of white paper. In this book, we aim to delve into a more in-depth discussion of the semiconductor market, with an emphasis on the product perspective. To accomplish this, we will extensively draw upon various academic and market resources. Additionally, in order to foster a comprehensive understanding of the market, it is necessary to have a certain level of familiarity with technical elements. Therefore, some technical explanations alongside the discussions is provided. In this book, we primarily focus on the FAB (Fabrication) domain. This book is divided into three major parts. Part 1 provides an overview of the semiconductor market, covering the definition, significance, supply chain structure, regional characteristics, challenges, and more within the semiconductor industry. Part 2, the major portion of this book, offers a comprehensive explanation of the most widely used types of semiconductor products. Particularly high market share products, notably Microcomponents, APs, and memory semiconductors, will have separate in-depth descriptions provided in the appendix. Finally, Part 3 will outline the general process by which these products are designed, focusing on a typical perspective, up to the stage just before Foundry.
Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.
Providing a comprehensive insight into today's standard technologies, this book covers the vast range of semiconductor products and their possible applications. The material ranges from the basics of conventional semiconductor technology through standard, power and opto semiconductors, to highly complex memories and microcontrollers and the special devices and modules for smartcards, automotive electronics, consumer electronics and telecommunications. Several chapters are devoted to the production of semiconductor components and their use in electronic systems, as well as to quality management. The book offers both students and users a unique overview of technology, architecture and areas of application of semiconductor products. The enclosed CD-ROM includes data on a multitude of products.
Discover How to Launch and Succeed as a Fabless Semiconductor Firm Fabless Semiconductor Implementation takes you step-by-step through the challenges faced by fabless firms in the development of integrated circuits. This expert guide examines the potential pitfalls of IC implementation in the rapidly growing fabless segment of the semiconductor industry and elaborates how to overcome these difficulties. It provides a comprehensive overview of the issues that executives and technical professionals encounter at fabless companies. Filled with over 150 on-target illustrations, this business-building tool presents a clear picture of the entire lifecycle of a fabless enterprise, describing how to envision and execute fabless IC implementation. Inside This Comprehensive Guide to Fabless IC Design - Define and specify the product Understand the customer requirements, the value chain, and the supply chain Select the right implementation approach, including “make” vs. “buy” Choose the best technologies and supply chain Implement IC design, fabrication, and manufacturing Build the operations infrastructure to meet cost and quality requirements Program-manage the distributed supply chain