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The aim of these proceedings is to present and stimulate discussion on the many subjects related to ion implantation among a broad mix of specialists from areas as diverse as materials science, device production and advanced ion implanters.The contents open with a paper on the future developments of the microelectronics industry in Europe within the framework of the global competition. The subsequent invited and oral presentations cover in detail the following areas: trends in processing and devices, ion-solid interaction, materials science issues, advanced implanter systms, process control and yield, future trends and applications.
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Keeping nanoelectronics in focus, this book looks at interrelated fields namely nanomagnetics, nanophotonics, nanomechanics and nanobiotechnology, that go hand-in-hand or are likely to be utilized in future in various ways for backing up or strengthening nanoelectronics. Complementary nanosciences refer to the alternative nanosciences that can be combined with nanoelectronics. The book brings students and researchers from multiple disciplines (and therefore with disparate levels of knowledge, and, more importantly, lacunae in this knowledge) together and to expose them to the essentials of integrative nanosciences. The central idea is that the five identified disciplines overlap significantly and arguably cohere into one fundamental nanotechnology discipline. The book caters to interdisciplinary readership in contrast to many of the existing nanotechnology related books that relate to a specific discipline. The book lays special emphasis on nanoelectronics since this field has advanced most rapidly amongst all the nanotechnology disciplines and with significant commercial pervasion. In view of the significant impact that nanotechnology is predicted to have on society, the topics and their interrelationship in this book are of considerable interest and immense value to students, professional engineers, and reserachers.
Nanoelectronics is one of the most important technologies of nanotechnology. It plays vital role in the field of engineering and electronics. Nanoelectronics make use of scientific techniques at atomic scale for developing the nano machines. The main target is to reduce the size, risk factor and surface areas of the materials and molecules. Machines under nanoelectronic process under goes the long range of manufacturing steps each with accurate molecular treatment. Semiconductor electronics have seen a sustained exponential reduce in size and cost and a similar augment in performance and level of integration over the last thirty years. The Silicon Roadmap is laid out for the next ten years. After that, either economical or physical barriers will pose a huge challenge. The former is connected to the difficulty of making a profit in view of the exorbitant costs of building the necessary manufacturing capabilities, if present day technologies are extrapolated. The latter is a direct consequence of the shrinking device size, leading to physical phenomena impeding the operation of current devices. The transistor is the building block to a modern processor. The current silicon designed transistors are going to hit their physical limit- not merely the actualization of Moore's law but also the problems with heat dissipation, wire connections and the materials we use to create them. Hence nanotechnology helps us to look at new ways information processing at a better speed and measure. A promising alternative to the imminent challenges from the CMOS based computing is to focus on other alternatives of nano scale precision. Chemically Assembled Electronic Nanotechnology (CAEN) is a promising technology, which uses self-alignment to construct electronic circuits from nano scale devices that take advantage of quantum mechanical effects. This book is intended as an introduction to the field of nanotechnology for nanoelectronics vendors, researchers and students who want to start thinking about the potential opportunities afforded by these emerging scientific developments.