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Special topic volume with invited peer reviewed papers only.
In this book basic and some more advanced thermodynamics and phase as well as stability diagrams relevant for diffusion studies are introduced. Following, Fick’s laws of diffusion, atomic mechanisms, interdiffusion, intrinsic diffusion, tracer diffusion and the Kirkendall effect are discussed. Short circuit diffusion is explained in detail with an emphasis on grain boundary diffusion. Recent advances in the area of interdiffusion will be introduced. Interdiffusion in multi-component systems is also explained. Many practical examples will be given, such that researches working in this area can learn the practical evaluation of various diffusion parameters from experimental results. Large number of illustrations and experimental results are used to explain the subject. This book will be appealing for students, academicians, engineers and researchers in academic institutions, industry research and development laboratories.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
The topic of hydrogen in an on metals and alloys is important in a number ofdisciplines including solid-state physics, materials science, physical chemistry, and energy technology. This volume treats the dynamics of hydrogen in intermetallic compounds, surface properties, kinetics, and applications of metal hydrides in energy technology. In addition, selected experimental methods are described. The introductory chapter will enable non-specialists to gain an overall picture of the field and to appreciate the relevant scientific issue. The companion volume, Hydrogene in Intermetallic Compounds I, was published as Vol. 63 of Topics in Applied Physics.