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The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Electroplating: Basic Principles, Processes and Practice offers an understanding of the theoretical background to electroplating, which is essential if the practical results are to be as required. This book is different in that it explains HOW the electrodeposition processes work, covering such topics as the elctrodeposition of composites, multilayers, whisker formation and giant magnetoresistive effects. The section on R & D approaches will be especially useful for organisations in the field. This is the first English language version of a well-known German language book from a prestigious author of international repute.'Electroplating' is an invaluable resource for manufacturers of coatings, electrochemists, metal finishers and their customers and academics in surface engineering.·Offers an understanding of the theoretical background to electroplating·Explains how the electrodeposition processes work·Prestigious author of international repute
The symposium was jointly held by the US and Japanese societies, but drew participants from companies, universities, and research institutes in 12 countries. The 47 papers cover high density packaging and related technologies, electronic devices and related materials and processes, micro-electromechanical systems and microfabrication, magnetic materials and devices, and fundamental studies on the materials for electrochemical technology applications. Nearly half of them, 23, were invited. Annotation copyrighted by Book News Inc., Portland, OR.
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Fundamentals of Electrochemical Growth: From UPD to Microstructures ¿ Symposium in Memory of Prof. Evgeni Budevski¿, held during the 216th meeting of The Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009.
Nickel and Chromium Plating, Second Edition, does not merely update the first edition but also places additional emphasis on certain methods that have achieved increased industrial use in the 14 years since the first edition was published. The book begins by tracing the history of nickel and chromium plating. This is followed by a discussion of the electrochemistry of electrodeposition from aqueous electrolyte solutions. Separate chapters cover topics such as autocatalytic (electroless) nickel deposition; nickel plating onto aluminum and other difficult substrates; plating onto plastics and high-speed plating; the deposition of various nickel alloys for decorative and functional applications; composite coatings; and tampon (brush) plating. This book will be helpful to those new to the plating industry; those experienced in the industry will find that this revised version enables them to keep up-to-date with the latest developments in this specialized technology.
The electronics industry underwent a rapid evolution from thick to thin films during the last decade. Electrochemical technology played an important and often decisive role in the direction of this evolution. Applications include plating through mask technology, plating for thin film heads, plating for high density magnetic thin film, selective etching technology, etc. New electrochemical approaches have also been developed which will play key roles in the electronics industry. This book reports on the latest progress in electrochemical processes, including fundamentals and applications. Additional volumes dealing with more specific applications of electrochemistry are also planned.
This volume in the "Advances in Electrochemical Sciences and Engineering" series focuses on problem-solving, illustrating how to translate basic science into engineering solutions. The book's concept is to bring together engineering solutions across the range of nano-bio-photo-micro applications, with each chapter co-authored by an academic and an industrial expert whose collaboration led to reusable methods that are relevant beyond their initial use. Examples of experimental and/or computational methods are used throughout to facilitate the task of moving atomistic-scale discoveries and understanding toward well-engineered products and processes based on electrochemical phenomena.
The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.