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Thin film science and technology plays an important role in the high-tech industries. The production of thin films for device purposes has been developed over the past 40 years. Thin films as a two-dimensional system are of great importance to many real-world problems. Their material costs are very small as compared to the corresponding bulk material and they perform the same function when it comes to surface processes. Thus, knowledge and determination of the nature, functions and new properties of thin films can be used for the development of new technologies for future applications. Some of the important applications of thin films are microelectronics, communications, optical electronics, catalysis, coating of all kinds, and energy generation and conservation strategies. This book emphasizes the importance of thin films in new technologies. It presents basic concepts, techniques, materials, processing and applications of thin films. As thin film physics and technology is a multidisciplinary filed, the book will be useful to a wide variety of readers (especially young researchers) in physics, electronic engineering, materials science and metallurgy.
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and optimization of manufacturing equipment and hence reduce the cost and improve the quality of the reactors. This book is the result of two parallel lines of research dealing with the same subject - Modeling of Tungsten CVD processes -, which were per formed independently under very different boundary conditions. On the one side, Chris Kleijn, working in an academic research environment, was able to go deep enough into the subject to laya solid foundation and prove the validity of all the assumptions made in his work. On the other side, Christoph Werner, working in the context of an industrial research lab, was able to closely interact with manufacturing and development engineers in a modern submicron semiconductor processing line. Because of these different approaches, the informal collaboration during the course of the projects proved to be extremely helpful to both sides, even though - or perhaps because - different computer codes, different CVD reactors and also slightly different models were used. In spite of the inconsistencies which might arise from this double approach, we feel that the presentation of both sets of results in one book will be very useful for people working in similar projects.
Patterning technology; Selective doping techniques; Materials; Rapid thermal annealing; Thin film technology; Amorphous silicon; Superconductor electronics; Advanced device technology; MOS and bipolar technology; Circuit design; Silicon on insulator technologies; Yield/reliability; Process characterization; Materials characterization; Fab operations.