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Quality Electronic Design (QED)’s landscape spans a vast region where territories of many participating disciplines and technologies overlap. This book explores the latest trends in several key topics related to quality electronic design, with emphasis on Hardware Security, Cybersecurity, Machine Learning, and application of Artificial Intelligence (AI). The book includes topics in nonvolatile memories (NVM), Internet of Things (IoT), FPGA, and Neural Networks.
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by-construction (i.e., optimization during routing) as well as construct-by-correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.
This book provides comprehensive coverage of state-of-the-art integrated circuit authentication techniques, including technologies, protocols and emerging applications. The authors first discuss emerging solutions for embedding unforgeable identifies into electronics devices, using techniques such as IC fingerprinting, physically unclonable functions and voltage-over-scaling. Coverage then turns to authentications protocols, with a special focus on resource-constrained devices, first giving an overview of the limitation of existing solutions and then presenting a number of new protocols, which provide better physical security and lower energy dissipation. The third part of the book focuses on emerging security applications for authentication schemes, including securing hardware supply chains, hardware-based device attestation and GPS spoofing attack detection and survival. Provides deep insight into the security threats undermining existing integrated circuit authentication techniques; Includes an in-depth discussion of the emerging technologies used to embed unforgeable identifies into electronics systems; Offers a comprehensive summary of existing authentication protocols and their limitations; Describes state-of-the-art authentication protocols that provide better physical security and more efficient energy consumption; Includes detailed case studies on the emerging applications of IC authentication schemes.
This book offers the first comprehensive coverage of digital design techniques to expand the power-performance tradeoff well beyond that allowed by conventional wide voltage scaling. Compared to conventional fixed designs, the approach described in this book makes digital circuits more versatile and adaptive, allowing simultaneous optimization at both ends of the power-performance spectrum. Drop-in solutions for fully automated and low-effort design based on commercial CAD tools are discussed extensively for processors, accelerators and on-chip memories, and are applicable to prominent applications (e.g., IoT, AI, wearables, biomedical). Through the higher power-performance versatility techniques described in this book, readers are enabled to reduce the design effort through reuse of the same digital design instance, across a wide range of applications. All concepts the authors discuss are demonstrated by dedicated testchip designs and experimental results. To make the results immediately usable by the reader, all the scripts necessary to create automated design flows based on commercial tools are provided and explained.
This book presents an overview of the issues related to the test, diagnosis and fault-tolerance of Network on Chip-based systems. It is the first book dedicated to the quality aspects of NoC-based systems and will serve as an invaluable reference to the problems, challenges, solutions, and trade-offs related to designing and implementing state-of-the-art, on-chip communication architectures.
This book constitutes the thoroughly refereed post-proceedings of the 6th International Conference on Theory and Applications of Satisfiability Testing, SAT 2003, held in Santa Margherita Ligure, Italy, in May 2003. The 33 revised full papers presented together with 5 articles reporting results of the related SAT competition and QBF evaluation were carefully selected during two rounds of reviewing and improvement from 67 submissions. The whole spectrum of research in propositional and quantified Boolean formula satisfiability testing is covered including proof systems, search techniques, probabilistic analysis of algorithms and their properties, problem encodings, industrial applications, specific tools, case studies, and empirical results.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.