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The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.
FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
The volume presents high quality papers presented at the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017). The book discusses recent trends in technology and advancement in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes original papers based on original theoretical, practical, experimental, simulations, development, application, measurement, and testing. The applications and solutions discussed in the book will serve as a good reference material for future works.
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
This book discusses key aspects of MEMS technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. ?Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliability issues concerning both electronic and mechanical aspects of these devices and systems are also addressed in various chapters.
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Cross-Word Modeling for Arabic Speech Recognition utilizes phonological rules in order to model the cross-word problem, a merging of adjacent words in speech caused by continuous speech, to enhance the performance of continuous speech recognition systems. The author aims to provide an understanding of the cross-word problem and how it can be avoided, specifically focusing on Arabic phonology using an HHM-based classifier.
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.